The recommended PCB footprint for VDRS20W250BSE is a rectangular pad with dimensions of 5.08mm x 3.81mm, with a thermal pad of 2.54mm x 2.54mm in the center. The pad should have a solder mask defined (SMD) and a solder paste layer.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pad, and use a reflow oven or a hot air gun to solder the component.
The maximum operating temperature range for VDRS20W250BSE is -55°C to 150°C. However, the device's power rating is derated above 125°C, and it is recommended to operate the device below 125°C for optimal performance and reliability.
VDRS20W250BSE is a high-power resistor, but it is not designed for high-frequency applications. The device's self-resonant frequency is around 100 MHz, and it may not perform well above 10 MHz. For high-frequency applications, consider using a resistor with a higher frequency rating.
VDRS20W250BSE is an ESD-sensitive device, and it requires proper handling and storage to prevent damage. Use an ESD wrist strap or mat when handling the device, and store it in an ESD-protective package or bag.
