VS-10ETS08PBF datasheet by Vishay Semiconductors

VS-10ETS08PBF Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for VS-10ETS08PBF?
  The recommended PCB footprint for VS-10ETS08PBF is a standard SOT23 package with a minimum pad size of 1.3mm x 1.3mm and a thermal pad size of 2.5mm x 2.5mm.
• Can I use VS-10ETS08PBF in a high-temperature environment?
  Yes, VS-10ETS08PBF is rated for operation up to 150°C, but it's recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet.
• How do I ensure reliable soldering of VS-10ETS08PBF?
  To ensure reliable soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a soldering flux that is compatible with the component's lead-free finish.
• Is VS-10ETS08PBF compatible with lead-free soldering processes?
  Yes, VS-10ETS08PBF has a lead-free finish and is compatible with lead-free soldering processes, such as SAC305 or Sn96.5Ag3Cu0.5.
• What is the typical turn-on time for VS-10ETS08PBF?
  The typical turn-on time for VS-10ETS08PBF is around 10ns to 20ns, depending on the input signal rise time and the output load.