The recommended PCB footprint for the VS-HFA08TA60C-N3 is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. Avoid using excessive solder or flux, and ensure the component is properly aligned on the PCB.
The maximum allowed voltage derating for the VS-HFA08TA60C-N3 is 10% of the rated voltage, which is 60 V. Therefore, the maximum allowed voltage derating is 6 V.
The VS-HFA08TA60C-N3 is rated for operation up to 150°C. However, it's recommended to derate the voltage and current ratings according to the temperature derating curve provided in the datasheet to ensure reliable operation.
Handle the VS-HFA08TA60C-N3 with care to avoid mechanical stress, bending, or twisting. Store the components in their original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the components to extreme temperatures or humidity during shipping.
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