The recommended PCB footprint for the VS-HFA25TB60PBF is a rectangular pad with a minimum size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
The maximum allowed voltage derating for the VS-HFA25TB60PBF is 80% of the maximum rated voltage, which is 600V. Therefore, the maximum allowed voltage derating is 480V.
The VS-HFA25TB60PBF is rated for operation up to 150°C. However, it's recommended to derate the voltage and current ratings at high temperatures to ensure reliable operation. Consult the datasheet for specific derating guidelines.
Handle the VS-HFA25TB60PBF with care to prevent mechanical damage. Store them in their original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads during handling.
VS-HFA25TB60PBF datasheet
by Vishay Semiconductors
