The recommended PCB footprint for the VS-HFA32PA120CPBF is a rectangular pad with a minimum size of 3.5mm x 2.5mm, with a 1.5mm diameter thermal pad in the center.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Avoid applying excessive heat or pressure, which can damage the component.
The maximum allowed voltage derating for the VS-HFA32PA120CPBF is 80% of the maximum rated voltage, which is 96V for this component.
Handle the VS-HFA32PA120CPBF with care to avoid mechanical stress, and store it in a dry, cool place away from direct sunlight. Use anti-static packaging and follow ESD precautions during shipping.
The typical lead time for delivery of the VS-HFA32PA120CPBF varies depending on the supplier and the quantity ordered, but it is typically around 6-12 weeks.
VS-HFA32PA120CPBF datasheet
by Vishay Semiconductors
