The recommended PCB footprint for the VS-MBR1100TR is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. Avoid using excessive solder or flux, and ensure the component is properly aligned on the PCB.
The maximum allowable voltage stress on the VS-MBR1100TR during assembly is 50 V for a maximum of 1 second, to prevent damage to the internal components.
The VS-MBR1100TR is rated for operation up to 150°C, but it's recommended to derate the power handling by 20% for every 10°C above 125°C to ensure reliable operation.
Handle the VS-MBR1100TR with ESD-protective equipment, such as wrist straps, mats, or bags, to prevent electrostatic discharge damage. Ensure the workspace is ESD-protected and follow proper handling procedures.
