WSL2512R0200FEA18 datasheet by Vishay Dale

WSL2512R0200FEA18 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for WSL2512R0200FEA18?
  The recommended land pattern for WSL2512R0200FEA18 is a rectangular pad with a size of 2.5mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape.
• Can I use WSL2512R0200FEA18 in a high-temperature environment?
  Yes, WSL2512R0200FEA18 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, derating may be necessary for prolonged exposure to high temperatures.
• How do I handle the component during assembly to prevent damage?
  Handle WSL2512R0200FEA18 by the edges to prevent damage to the resistive element. Avoid touching the component's surface, as the oils from human skin can affect its performance.
• What is the recommended soldering profile for WSL2512R0200FEA18?
  The recommended soldering profile for WSL2512R0200FEA18 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. A reflow soldering process is recommended.
• Can I use WSL2512R0200FEA18 in a high-humidity environment?
  Yes, WSL2512R0200FEA18 is designed to operate in humid environments, but it's essential to follow proper storage and handling procedures to prevent moisture absorption.