A recommended PCB layout for the ZXBM2003X10TC includes a solid ground plane, short and wide traces for the input and output, and a decoupling capacitor (e.g., 10nF) between the input and ground. Additionally, keep the device away from high-frequency noise sources and ensure good thermal dissipation.
To ensure stability, follow the recommended PCB layout, use a low-ESR input capacitor (e.g., 10uF), and add a small resistor (e.g., 10Ω) in series with the input capacitor. Also, ensure the output is properly decoupled and the device is operated within its recommended operating conditions.
The maximum allowed input voltage ripple for the ZXBM2003X10TC is typically around 1% of the input voltage (e.g., 100mV for a 10V input). Exceeding this limit may affect the device's performance and stability.
The ZXBM2003X10TC is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure proper thermal management, such as heat sinking and airflow, to maintain a safe operating temperature.
The power dissipation of the ZXBM2003X10TC can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current. Ensure the calculated power dissipation is within the device's recommended rating.
ZXBM2003X10TC datasheet
by Diodes Incorporated
