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    DSAE0032001.pdf by Freescale Semiconductor

    • Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead (QFN) Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed
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    0.65mm pitch BGA 4914 smd 4x4 mm pkg, 0.5mm pad pitch JEDEC MO-220 Compliant AN1902 EIA 783 EIA and EIAJ standards 783 EIA-783 FOOTPRINT MO-229 2X3 SOLDERING freescale QFN 64 8x8 footprint JEDEC JESD51-8 BGA JEDEC MO229 LAND PATERN JESD51-3 JESD51-5 JESD51-7 land pattern BGA 0.75 freescale land pattern for QFN 7x7 MO-220 MO-220 7x7 0.4 pitch MO-229 qfn 44 PACKAGE footprint 7x7 QFN 56 7x7 footprint QFN 64 8x8 footprint QFN 64 9x9 footprint qfn 64 9x9 stencil qfn 64 pcb layout QFN 76 9x9 footprint Theta-JC QFP die down tqfp 64 pcb land pattern

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