DSASW004447.pdf by NXP Semiconductors

Partial File Text MF0 IC U10 01 120 µm Bumped sawn wafer on UV-tape contactless single-trip ticket ICs Rev. 3.2 -- 16 March 2007 Product data sheet 124832 PUBLIC 1. General description 1.1 Scope The MF
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contactless Functional Specification MIFARE Card Coil Design Guide UV-tape