DSA0027347.pdf by Intersil

Partial File Text PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages ® Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline
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ipc-SM-782 J-STD-005 land pattern for DFN MO-220 nozzle heater pitch 0.4mm BGA qfn Substrate design guidelines TB389 Technical Brief TB389 two tinned touch pads

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