DSA00178704.pdf

Partial File Text FUJITSU/SUN MICROSYSTEMS ULTRASPARC-IIi MCM: MINIATURIZATION TO THE EXTREME Michelle Hou Fujitsu San Jose, CA USA Takashi Ozawa Fujitsu Kawasaki, JAPAN Dev Malladi, Chris Furman, Mary Kreb
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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45X45mm INCOMING PACKAGING MATERIAL INSPECTION form Low viscosity underfill for flip chip MIL-STD-105C motherboard major problems & solutions underfill