DSASW00198778.pdf by Intersil

Partial File Text Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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"exposed pad" PCB via "thermal via" 40-QFN P4171 QFN "exposed die" QFN 5x5 qfn 5X5 land pattern qfn stencil solder mask via diameter pitch X-RAY INSPECTION

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