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    DSAZIHA2X00062608.pdf by Micrel Semiconductor

    • Reportable Substances in Components Package Type : Component Weight : 0.0233 grams QFN... 33 (3.0mmx3.0mm) Lead #: No 1 16LD Material Content in % Molding Compound 46.46% more
    • Original
    • Unknown
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    DSAZIHA2X00062608.pdf preview
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