DSA00173910.pdf by National Semiconductor

Partial File Text Plastic Package Moisture-Induced Cracking Introduction With the older "through-hole" technology packages such as the Dual In-line Package (DIP), soldering to printed circuit boards was accomplishe
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSA00173910.pdf preview

Download Datasheet

User Tagged Keywords

Furnace MIL-D-3464 MIL-D-3464 type 1 MIL-D-3464 type 1 and 2 MIL-D3464 MILD-3464

Price & Stock Powered by