DSASW00135399.pdf

Partial File Text PROCESS CP317 Small Signal Transistor NPN - RF Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 14.5 x 14.5 MILS Die Thickness 9.0 MILS Base Bonding Pad A
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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