DSA0039338.pdf by Xilinx

Partial File Text Application Note: Packaging R XAPP427 (v2.4) February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and
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BFG95 BGA PROFILING BGA reflow guide FFG1136 FFG1738 FFG1738* moisture FFG668 FFG672 FFG676 fgg484 IPC-A-610D IPC-A610D Lead Free reflow soldering profile BGA PQG100 PQG160 PQG208 TQG144 VOG48 XAPP427