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DSAZIHA2X00053453.pdf
by Intersil
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Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20K 20 BALL WAFER L
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EVEL CHIP SCALE PACKAGE (WLCSP) Rev 0, 8/14 1.200 X Y 1.82±0.030 0.400 E 20x 0.265±0
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