DSA00170167.pdf

Partial File Text Cypress Semiconductor Package Qualification Report 000201 VERSION 1.0 October, 2000 48 Fine Pitch Ball Grid Array (FBGA) Level 3 7mm x 7 mm Cypress Philippines Assembly CYPRESS TECHNICAL CO
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSA00170167.pdf preview

Download Datasheet

User Tagged Keywords

BAI 59 FBGA PACKAGE thermal resistance plaskon