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    DSA0025144.pdf by Fujitsu

    • LEADLESS CHIP CARRIER 16 PAD CERAMIC LCC-16C-F01 EIAJ code : QFN016-G-S250-1 Lead pitch ... 50mil Package width × package length 250 × 250mil Sealing method 16-pad ceramic LCC Fri more
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    CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 52 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
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