DSAE0013690.pdf by Intersil

Partial File Text PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages ® Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline
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IPC-SM-782 J-STD-005 MO-220 nozzle heater Soldering guidelines and SMD footprint design TB389 Technical Brief TB389