DSAH00473790.pdf by Philips Semiconductors

Partial File Text INTEGRATED CIRCUITS SL1 ICS31 01 Bumped I·CODE1 Label IC (97pF) (IC with Bumps) Chip Specification Product Specification Revision 1.2 Public July 2000 Philips Semiconductors Product Speci
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ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE snw-fq-627