Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAE0010259.pdf by Hittite Microwave

    • v02.0109 LC3 ­ 3 x 3 mm QFN CERAMIC HIGH FREQUENCY SMT PACKAGE PACKAGE OUTLINES LC3 Package Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING:
    • Original
    • Unknown
    • Unknown
    • Unknown
    • Powered by Findchips Logo Findchips

    DSAE0010259.pdf preview

    User Tagged Keywords

    qfn land pattern
    Supplyframe Tracking Pixel