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    DSASW00104259.pdf by Allegro MicroSystems

    • Product Information Allegro Package Designations This document provides reference information as an aid to differentiating the device package types used by Allegro® MicroSystems. It provides cro
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    16 soic pcb footprint ALLEGRO PART NUMBER INDEX ALLEGRO U PACKAGE BRANDING EA DFN 10 socket dfn et DFN et_ DUAL ROW QFN leadframe EK QFN footprint dip 16 footprint soic J-Lead, plcc JEDEC TSSOP 28 LEAD PACKAGE MO-153-BD-1 MO-220VHHD MO-220WEED MO-220WGGC MS-013-AB MS-018-AB MS-018AC obsolete ic cross reference PUB26013 qfn 44 PACKAGE footprint qsop 16 pcb footprint sohed SOT23 MARK EW SOT23W-3 TQFP 100 PACKAGE footprint transistor crossreference WLCSP chip mount

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