DSA00391854.pdf
by KOA Speer Electronics
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RESISTORS
TECHNOLOGY OF TOMORROW
THICK FILM HIGH VOLTAGE HV73
STRUCTURE
1 2 3 4 5 6 7 8 9 10 Ceramic substrate Top termination (Ag Pd) Bottom termination (Ag) Resistive layer Glass layer Trimm
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Original
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Unknown
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Unknown
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Unknown
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