DASF0029997.pdf by Motorola

Partial File Text Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc... by Thomas Koschmieder and Michael Leoni Introduction Th
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12x12mm BGA package thermal resistance LGA Application Notes LGA Application Notes motorola lga components LGA PACKAGE thermal resistance pitch 0.4mm BGA solder wire 0.3 mm X-RAY INSPECTION