DSA00269315.pdf by Central Semiconductor

Partial File Text PROCESS CPD76V Schottky Diode 1.0A Schottky Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 32 x 32 MILS Die Thickness 7.1 MILS Anode Bonding Pad Area 26 x
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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