DSAASSA0009332.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads 3.3 2.9 1.9 SOT23 3 1.7 2 solder land solder paste deposit solder lan
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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