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    DSAASSA0009330.pdf by NXP Semiconductors

    • Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962 0.85 0.4 R0.025 (8×) 0.4 0.22 (2×) 0.12 (2×) 0.2 (2×) sol
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