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DSADA0016302.pdf
Manufacturer
OKI Electric Industry
Partial File Text
DIP22-P-300-2.54-S1 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5µm) 1.88 TYP. 2/Dec. 11, 1996
Type
Original
ECAD Model
Part Details
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