"MICRO-X" SOLDER PAD LAYOUT Search Results

IPC-SM-785

Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
Contextual Info: National Semiconductor Application Note 1112 March 2002 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning

stencil tension

Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
Contextual Info: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning

BGA-3000

Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball
Contextual Info: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste

entek plus cu 106a

Abstract: PACDN3401C
Contextual Info: PACDN3401C Transient Voltage Suppressor, Single 5V, 0402 SMD Features Applications • Single channel voltage suppressor in a surface mount EIA standard 0402-sized device • Cell phones • Compact 0402 size saves board space and eases layout in area critical applications compared to

ALIVH

Abstract: WLCSP smt 250 B 340 smd Transistor WLCSP stencil design AN-1112 national semiconductor pb-free marking 250 micro solder ball 9221 MARKING MARKING SMD IC CODE smd diode ED
Contextual Info: National Semiconductor Application Note 1112 September 9, 2009 Table of Contents Introduction . 2 Package Construction . 2

ALIVH

Abstract: national semiconductor pb-free marking AN-1112 JESD51-3 MARKING CODE SMD IC General Semiconductor smd gm 9221 MARKING
Contextual Info: National Semiconductor Application Note 1112 December 18, 2007 Table of Contents Introduction . 2 Package Construction . 2

AN-1112

Abstract: ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC
Contextual Info: National Semiconductor Application Note 1112 January 13, 2010 Table of Contents Introduction . 2 Package Construction . 2

JESD22-B117

Abstract: MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110
Contextual Info: VISHAY SILICONIX Power MOSFETs Application Note 835 PCB Design and Surface-Mount Assembly Guidelines for MICRO FOOT Packages By Changsheng Chen/Greg Getzan Introduction The Vishay Siliconix MICRO FOOT® product family is based on wafer-level chip scale packaging WL-CSP

ALIVH

Abstract: JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement
Contextual Info: National Semiconductor Application Note 1412 June 9, 2009 Table of Contents Introduction . Package Construction .

ALIVH

Abstract: HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC
Contextual Info: National Semiconductor Application Note 1112 September 2005 Table of Contents Introduction . 2 Package Construction . 2

ALIVH

Abstract: AN-1112 AN1112 ALIVH PCB joint JESD51-3
Contextual Info: National Semiconductor Application Note 1112 January 13, 2010 Table of Contents Introduction . 2 Package Construction . 2

IPC-SM-785

Abstract: stencil tension AN-1112
Contextual Info: National Semiconductor Application Note 1112 April 2003 Table of Contents Introduction . Package Construction .

AN-1112

Abstract: solder joint reliability IPC-SM-785 Solder paste stencil life thick bga die size Semiconductor smd marking BY SMD 420
Contextual Info: National Semiconductor Application Note 1112 March 2002 Table of Contents Introduction to MICRO SMD . Package Construction .

ALIVH

Abstract: pcb thermal Design guide trace theta layout AN-1412 7x8 64 footprint micro solder ball
Contextual Info: National Semiconductor Application Note 1412 May 2006 Table of Contents Introduction . Package Construction .

fbga Substrate design guidelines

Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195
Contextual Info: Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package CSP is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate with copper signal and plain layers. The small form factor allows for enhanced conduction of heat to the PCB

LPC2468 reflow solder profile

Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,

FOOTPRINT MO-229 2X3 SOLDERING

Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level

MICRO SWITCH PRESSURE PCB

Abstract: Vishay Siliconix soldering bga without underfill 71990 AN824 63Sm DG3000DB Si8900EDB Si8902EDB UP78
Contextual Info: AN824 Vishay Siliconix PCB Design and Assembly Guidelines For MICRO FOOTr Products Johnson Zhao INTRODUCTION Vishay Siliconix’s MICRO FOOT product family is based on a wafer-level chip-scale packaging WL-CSP technology that implements a solder bump process to eliminate the need for an

8 PIN SMD IC 211

Abstract: BGA-3000 top mark smd A9 SMD MARK A9 shaker
Contextual Info: National Semiconductor Application Note 1112 September 1999 CONTENTS Package Construction ing, singulation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for Micro SMD 4 and 8 I/O Packages

vishay siliconix code marking 3 SMD

Abstract: DG3003DB-T1-E1 si89 si8902 mw-6 SMD CHIP s11030
Contextual Info: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as

Contextual Info: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as

Contextual Info: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as

Contextual Info: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as

PCB layout guidelines for NXP MCUs in BGA packages

Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,