TFBGA208 Search Results

Contextual Info: Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm B D SOT950-1 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A e e2 ball A1 index area

Contextual Info: Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 12 x 12 x 0.7 mm D B SOT930-1 A ball A1 index area E A A2 A1 detail X C e1 ∅v ∅w b e M M y y1 C C A B C U T R P N e M L K e2 J H G F E D C B A ball A1 index area

Contextual Info: Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.8 mm SOT600-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e ball A1 index area y ∅w M C U T R P N M L K J H G F E D C B A shape optional 4x

TFBGA208

Contextual Info: PDF: 2003 Jul 17 Philips Semiconductors Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.8 mm SOT600-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e ball A1 index area ∅v M C A B b U T R P

TFBGA208

Abstract: sot600
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.8 mm SOT600-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k C e1 v M B b e ∅w M U T R P N M L K J H G F

TFBGA208

Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.8 mm SOT600-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e ∅v M C A B b U T R P N M L K J H G F E D

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of TFBGA208 package SOT950-1 Hx P P Hy 0.475 see detail X solder land CL solder paste deposit SR CU solder land plus solder paste SP occupied area solder resist detail X Dimensions in mm

TFBGA208

Abstract: TTBG0208JA-A
Contextual Info: JEITA Package Code T-TFBGA208-12x12-0.65 RENESAS Code TTBG0208JA-A Previous Code TBP-208A/TBP-208AV MASS[Typ.] 0.26g D w S B E w S A x4 v y1 S y A1 A S S ZD e A e U T R P Reference Symbol N M B L K J H Dimension in Millimeters Min Nom D 12.00 E 12.00 Max

TFBGA180

Abstract: 12MHz oscillator LPC2364 LPC2368 LPC2458 LPC2468 TFBGA100 TFBGA208 Future Designs
Contextual Info: SAB-TFBGAxxx SAB-TFBGAxxx Socket Adapter Boards for USB-ICP-LPC2K The SAB-TFBGAxxx Socket Adapter Boards extend the capability of our popular USB In-Circuit Programmer for NXP Semiconductors LPC2xx devices to allow the user to program and test these devices outside of their

LPC9221

Abstract: embedded c code to interface lpc2148 with sensor P89V51RD2 microcontroller LPC2148 i2c with sensor LPC925 p89v51rd2 LPC700 LPC2148 p89v51rd2 development board lpc1754
Contextual Info: April 2009 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from

LPC2148 i2c eeprom c code

Abstract: lcd c program using lpc2378 LPC2468 embedded c code to interface lpc2148 with sensor LPC932A1 LPC922 LPC932A lpc921 lpc935 ac motor control LPC2378 instruction cache
Contextual Info: August 2008 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from

LPC24XX

Abstract: timer video tms 9937 LPC2478FBD208 mst 702 lf LPC2468 pcb LPC2478 ARM7TDMI motor driver ic 7324 LPC247x LPC2478 pcb LPC2468FBD208
Contextual Info: UM10237 LPC24XX User manual Rev. 04 — 26 August 2009 User manual Document information Info Content Keywords LPC2400, LPC2458, LPC2420, LPC2460, LPC2468, LPC2470, LPC2478, ARM, ARM7, 32-bit, Single-chip, External memory interface, USB 2.0, Device, Host, OTG, Ethernet, CAN, I2S, I2C, SPI, UART, PWM, IRC,

LPC2000

Abstract: LPC2468 LPC2468FBD208 LPC2468FET208 LQFP208 TFBGA208
Contextual Info: LPC2468 Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface Rev. 02 — 16 October 2007 Preliminary data sheet 1. General description NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bit

nxp CAN BUS TRANSCEIVER

Abstract: TFBGA208 "32-Bit Microcontroller" 32 bit microcontroller architecture 5 port ethernet switch arm microprocessor data sheet nxp 32 bit LPC2460 LPC2460FBD208 LPC2460FET208
Contextual Info: LPC2420/2460 Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface Rev. 03 — 20 November 2008 Preliminary data sheet 1. General description NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bit

ARM7TDMI-S processor

Abstract: TFBGA208 SD Multimedia Card Specification Version 2.11 1 gb micro sd card LCD 320 240 EL 3.5 STN nxp CAN BUS TRANSCEIVER LPC2470 LPC2470FBD208 LPC2470FET208 LQFP208
Contextual Info: LPC2470 Flashless 16-bit/32-bit micro; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface Rev. 00.01 — 5 October 2007 Preliminary data sheet 1. General description NXP Semiconductors designed the LPC2470 microcontroller, powered by the

TFBGA208

Abstract: aseram SH7706 SH7751 EPF10K20RC208-3 SHE10 lqfp-216
Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

Contextual Info: D S "#$%&&'' fido11000 ATA HEET Flexible Input Deterministic Output (fido) 32-bit Real-Time Microcontroller with Configurable Peripherals DATA SHEET Version 9.4, March 2007 1 MARCH 2007, REV 9.4 DATA SHEET fido11000 2 MARCH 2007, REV 9.4 DATA SHEET fido11000

LPC1778FET

Contextual Info: LPC178x/7x 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC Rev. 3 — 27 December 2011 Objective data sheet 1. General description The LPC178x/7x is an ARM Cortex-M3 based microcontroller for embedded applications

Contextual Info: D D D D D A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D R R A FT FT FT A A R R D D D Flashless 16-bit/32-bit micro; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface R R R D D D F FT FT A A Preliminary data sheet A Rev. 00.03 — 29 January 2008

Contextual Info: LPC2468 Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface Rev. 01 — 3 September 2007 Preliminary data sheet 1. General description NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bit

ARM7 lpc2478 pin configuration

Abstract: LPC2478 In-Application programming LPC2478 pcb need of ARM7 lpc2478
Contextual Info: LPC2478 Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface Rev. 3 — 12 September 2011 Product data sheet 1. General description NXP Semiconductors designed the LPC2478 microcontroller, powered by the

Contextual Info: LPC178x/7x 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC Rev. 4 — 1 May 2012 Preliminary data sheet 1. General description The LPC178x/7x is an ARM Cortex-M3 based microcontroller for embedded applications

Contextual Info: LPC2420/2460 Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface Rev. 6.1 — 22 September 2011 Product data sheet 1. General description NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bit

PCB layout guidelines for NXP MCUs in BGA packages

Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,