0.5 MM PITCH TSSOP Search Results

CA-SO48C-Z-L-T-01

Contextual Info: Compatible Foot 1.811" 0.290" 0.230" 1 1.350" 1.25" 0.490" 0.5 mm pitch typ. 24 25 0.040" 4 Top View 0.794" 1 0.177" 3 6.02 mm assembled 0.040" pitch typ. 0.210" 2 0.50 mm pitch typ. Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating

Contextual Info: Competitive Package Cross-Reference: NXP Logic Products Package Image width x length x height mm Pitch (mm) NXP 0.5 GX 0.3 GN TI Fairchild ON Toshiba CMX fsV MicroPak 0.8 x 0.8 x 0.35 MicroPak 1.0 x 0.9 x 0.35 MicroPak GF FHX 0.35 1.0 x 1.0 x 0.5 GF 1.0 x 1.0 x 0.35 GS

tssop24 datasheet

Abstract: TSSOP24
Contextual Info: PDF: 2003 Oct 09 Philips Semiconductors Package outline TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.5 mm D SOP006 E c X HE Z 24 13 A A2 A1 pin 1 index θ Lp detail X 1 12 bp e 2.5 5 mm scale DIMENSIONS mm are the original dimensions

Contextual Info: Package outline TSSOP30: plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm SOT607-1 E D A X c HE y v M A Z 16 30 A2 pin 1 index A 3 A1 A θ Lp L 1 15 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

Contextual Info: Package outline TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm; lead pitch 0.5 mm SOT510-1 E D A X c HE y v M A Z 20 38 A2 A 3 A1 pin 1 index A θ Lp L 1 19 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

TSSOP30

Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline TSSOP30: plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm SOT607-1 E D A X c HE y v M A Z 16 30 A 3 A2 A A1 pin 1 index θ Lp L 1 15 bp e detail X w M 2.5 5 mm

sot510

Abstract: TSSOP38
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm; lead pitch 0.5 mm SOT510-1 E D A X c HE y v M A Z 20 38 A2 A 3 A A1 pin 1 index θ Lp L 1 19 bp e detail X w M 2.5 5 mm

TSSOP38

Abstract: TSSOP-38
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm; lead pitch 0.5 mm SOT510-1 E D A X c HE y v M A Z 20 38 A2 A 3 A A1 pin 1 index θ Lp L 1 19 bp e detail X w M 2.5 5 mm

tssop30

Abstract: sot607
Contextual Info: PDF: 2000 Feb 07 Philips Semiconductors Package outline TSSOP30: plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm SOT607-1 E D A X c HE y v M A Z 16 30 A2 A 3 A A1 pin 1 index θ Lp L 1 15 bp e detail X w M 2.5 5 mm

TSSOP38

Contextual Info: PDF: 2000 Feb 02 Philips Semiconductors Package outline TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm; lead pitch 0.5 mm SOT510-1 E D A X c HE y v M A Z 20 38 A2 A 3 A A1 pin 1 index θ Lp L 1 19 bp e detail X w M 2.5 5 mm

TVSOP-56

Abstract: TVSOP-48
Contextual Info: là PER ¡COM Package Cross Reference Guide Package Type TSSOP-48 TSSOP-56 BQSOP-40 BQSOP-48 BQSOP- O SSOP-14 SSOP-16 SSOP-20 SSOP-24 8 SSOP-28 TVSOP-48 TVSOP-56 TSSOP-8 TSSOP-14 TSSOP16 TSSOP 20 TSSOP 24 TSSOP 28 PDIP-8 PDIP-14 PDIP-16 PDIP-20 PDIP-24 PDIP-28

IC 7505

Contextual Info: Package Information TSSOP Outline Dimensions 16-pin TSSOP Outline Dimensions 1 6 9 E 1 1 8 E D L A R A 2 0 .1 0 B e C G A 1 y 4 C O R N E R S Symbol Dimensions in mm Min. Nom. Max. A 1 ¾ 1.05 A1 0.05 ¾ 0.15 A2 1.05 ¾ 1.2 B ¾ 0.25 ¾ C 0.11 ¾ 0.15 D

QSOP16 package

Abstract: SA SOT23-5 MIL I-22110C
Contextual Info: f i PERICOM I M | I I I I 11 I I I I I II I I I II I II I I II I I I I I I I I II I I I Il I I I I I I I I I I I I I I I I I I I I I I 1 1 I I II I 1 I I I I I I I I 11 I II I I I I I I I I Package Reference Guide TSSOP-48 TSSOP-56 BQSOP-40 BQSOP-48 BQSOP-80

Contextual Info: Package Information TSSOP Outline Dimensions 8-pin TSSOP Outline Dimensions 8 5 E 1 1 4 E D A L A 2 e R 0 .1 0 A 1 B C L 1 y G 4 C O R N E R S Symbol Dimensions in mm Min. Nom. Max. A 1.05 ¾ 1.20 A1 0.05 ¾ 0.15 A2 0.80 ¾ 1.05 B ¾ 0.25 ¾ C 0.11 ¾ 0.15

W9520

Abstract: W9502 W9524 W9503 W9503-2 W9518 W9531 W9501 W9522 w9526
Contextual Info: WINSLOW ADAPTICs Data Sheet – SOP to DIP Generic Adapters These adapters allow the prototyping of SOIC, SOJ, SSOP, TSOP and TSSOP devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

EDSD-1L8MM-REEL

Abstract: QFn 64 tape carrier
Contextual Info: TAPE AND REEL TAPE AND REEL SPECIFICATIONS—SURFACE MOUNT Tape and Reel Packing Tape and reel packing is available for all SO, TSOT thin SOT23 , SOT-23 3L/4L, SOT-223, SSOP, TSSOP, QFN, DFN and DD packages in accordance with EIA Specification 481-D with the following exceptions: (DFN(DCB), TSOT and SC70

Contextual Info: 3.3 V CMOS 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS FEATURES: - D E S C R IP T IO N : 0.5 MICRON CMOS Technology Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.635mm pitch SSOP, 0.50mm pitch TSSOP,

Contextual Info: 3.3 V CMOS 1-BIT TO 4-BIT ADDRESS DRIVER WITH 3-STATE OUTPUTS AND BUS-HOLD FE A T U R E S : - 0.5 MICRON CMOS Technology Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.635mm pitch SSOP, 0.50mm pitch TSSOP,

Contextual Info: 3.3V CMOS 16-BIT EDGETRIGGERED D-TYPE FLIPFLOP WITH 3-STATE OUT­ PUTS AND BUS-HOLD FE A T U R E S : - 0.5 MICRON CMOS Technology Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.635mm pitch SSOP, 0.50mm pitch TSSOP,

Contextual Info: 3.3 V CMOS 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS BE FEATURES: - 0.5 MICRON CMOS Technology Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) - 0.635mm pitch SSOP, 0.50mm pitch TSSOP,

Contextual Info: 3.3 V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS FEATURES: - 0.5 MICRON CMOS Technology Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) - 0.635mm pitch SSOP, 0.50mm pitch TSSOP,

Contextual Info: 3.3V CMOS 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS AND BUS-HOLD FE A T U R E S : - 0.5 MICRON CMOS Technology Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.635mm pitch SSOP, 0.50mm pitch TSSOP,

Contextual Info: 3.3V CMOS 16-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS, 5 VOLT TOLERANT I/O FE A T U R E S : - Typical - ESD > 2000V per MIL-STD-883, Method 3015; - 0.635mm pitch SSOP, 0.50mm pitch TSSOP tsK o (Output Skew) < 250ps > 200V using machine model (C = 200pF, R = 0)

Contextual Info: 3.3V CMOS 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS AND BUS-HOLD FE A T U R E S : - - 0.5 MICRON CMOS Technology Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.635mm pitch SSOP, 0.50mm pitch TSSOP,