FINISH10Μ Search Results

PA-PGA85-03

Contextual Info: 0.300" 1.100" 0.200" 0.100" typ. 1.500" Top View Bottom View only male pins shown for drawing clarity -03W version (3 level, 0.025" Sqr. WW pin) 0.100" 3 0.507" 0.165" 0.295" 2 0.700" 1 0.020" dia. typ. Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high

PGA zif socket

Abstract: PA-PGA108-03-Z
Contextual Info: 1.783" 1.600" 2.096" 1.800" 1.800" Top View 0.100" typ. 0.300" typ. Bottom View only male pins shown for drawing clarity 1 0.742" PA-PGA108-03Z Side View 3 0.020" dia.typ. 1.146" 0.025" sqr. PA-PGA108-03ZW Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high

PA-DIP28-CV-01

Contextual Info: 0.346" 28 15 0.600" 1 1 1.172" 14 3 2 0.132" Side View 0.100" typ. 0.020"±0.001" dia. 0.165" 0.050" 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 0.100" End View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating

PA-PGA192-01

Contextual Info: 1.800" 0.300" typ. 0.100" typ. 0.100" typ 2.400" Bottom View only male pins shown for drawing clarity Top View -01W version (3 level, 0.025" Sqr. WW pin) 1 3 0.297" 0.124" 2 0.700" 0.020" dia. typ. 0.507" Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high

PA-PGA176-02

Contextual Info: 0.300" typ. 2.200" 0.100" typ. 2.200" Top View Bottom View only male pins shown for drawing clarity -02W version (3 level, 0.025" Sqr. WW pin) 1 2 0.297" 0.507" 0.124" 0.700" 3 0.020" dia. typ. Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high

Contextual Info: 0.650" 0.100" typ. 0.750" 1 3 0.421" 4 0.207" 0.050" typ. 0.472" 1 3 4 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;

DIP52

Abstract: C1494
Contextual Info: Top View 2.600" 1 2 3 0.900" Side View Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact

PA-QFE160SC-C-N-01

Contextual Info: 2.000" Socket holes 0.5 mm pitch 2.295" 0.100" pitch typ. 1 0.250" 3 0.128" 0.018"±0.002" typ. 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .

SOIC32

Contextual Info: SA P1699 1.600" 0.400" Top View 1 0.100" typ. 3 0.291" 0.020" square typ. 0.140" 0.050" typ. Side View 5 0.120" 0.800" 0.316" 1 3 5 Description: PACKAGE CONVERTOR 32 position Dip female sockets to male soic surface mount pins. Pin assignment; 1:1. PC-DIP/SOIC32-05 Drawing

PA-MLF20C-P-Z-01

Contextual Info: 17mm [0.669"] 2.19mm [0.086"] 0.83mm [0.032"] 3.84mm x 3.84mm thermal /GND pad 7.54mm [0.297"] 0.9mm [0.035"] SMT Pad Detail 0.42mm -01W version 3 level, 0.64mm [0.025"] Sqr. WW pin 1.06mm 27.2mm [1.071"] 0.65mm 17.78mm [0.672"] 12.88mm [0.523"] 6.36mm [0.250"]

SF-QFE80SD-L-01

Contextual Info: 0.620" top and bottom pad width only see side view for side pad width 0.017" typ. 0.620" 0.540" Top View 0.050" pitch typ. 0.018" dia. typ. 2 0.250" 1 Side View 0.156" typ. 0.65 mm pitch typ. B A compatible target board land dimensions A< 0.570" B> 0.670"

CA-QFE100SC-L-S-T-03

Contextual Info: 0.670" 0.100" 1.150" 0.550" Top View 1.550" Side View 1 0.535" 3 0.635" Plugged 2 0.250" 0.5 mm 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ"

c1869

Abstract: sf 1020 ZIF pga 84
Contextual Info: 2.400" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

PA-MLF64A-P-Z-01

Contextual Info: 27mm [1.063"] SMT Pad Detail 0.28mm 0.79mm [0.031"] 0.69mm 5.63mm [0.222"] 3.34mm [0.131"] 7.58mm x 7.58mm thermal /GND pad 0.79mm [0.031"] 21.9mm [0.862"] 0.5mm 9.36mm [0.369"] Top View -01W version 3 level, 0.64mm [0.025"] Sqr. WW pin 7.98mm [0.314"]

PA-PGA52-03

Contextual Info: 0.600" 0.900" 0.100" typ. 2.600" 1 Top View Bottom View Only male pins shown for drawing clarity 0.173" 0.297" -03W version (3 level, 0.025" Sqr. WW pin) 3 2 0.020" dia.typ. 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating

PA-ZIP20-01

Contextual Info: 0.050" 0.050" 0.100" 0.850" 1 0.050" 0.100" 0.300" Top View 0.400" 0.173" 0.297" 2 Side View 3 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; shell finish- 10µ" Gold over 50µ" Nickel min. . Contact

SOIC-08

Abstract: SOIC08 BOX21151
Contextual Info: RoHS COMPLIANT 0.400" 1 0.400" 0.100" typ. 1 Adapter PCB - Substrate: 2.38mm ±0.18mm [0.094" ±0.007"] per IPC 4101/21, silver surface finish. 2 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;

DIP14

Abstract: DIP-14
Contextual Info: 0.700" 0.200" 0.025" 0.088" 0.400" 0.125" 0.325" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact materialBeCu; finish 10µ" Au over 100µ" Ni (min.)

SOIC20

Contextual Info: PROPRIETARY INFORMATION Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD ELECTRONICS, INC., is strictly prohibited and may be unlawful. If you have received this drawing in error, please return

CA-SO28U-Z-M-T-01

Contextual Info: 2.54mm [0.100"] Top View 2,1 4,3 6,5 8,7 10,9 12,11 14,13 1 28 14 15 27,28 25,26 23,24 17.78mm 21,22 [0.700"] 19,20 17,18 15,16 35.56mm [1.400"] 3 Side View 2 1 1 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating

PA-PGA121-01

Contextual Info: 1.300" 0.300" typ. 0.100" typ. 0.100" typ 1.400" Bottom View only male pins shown for drawing clarity Top View -01W version (3 level, 0.025" Sqr. WW pin) 1 0.507" 0.297" 0.124" 0.020" dia. typ. 0.700" 3 2 Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high

PA-PGA132-03

Contextual Info: 1.400" 0.300" typ. 0.100" typ. 0.100" typ. 1.700" Top View Bottom View only male pins shown for drawing clarity -03W version (3 level, 0.025" Sqr. WW pin) 0.507" 0.700" 1 3 0.297" 0.124" 0.020" dia. typ. Side View 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high

SF-QFE100SC-L-01

Contextual Info: 3 0.100 typ. 1.400 Top View 1.400 0.321 3 1 0.421" Plugged 2 0.250 1 Side View 0.5mm pitch 0.600 0.550 Bottom View (emulator foot only) 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish10µ" gold over 50µ" nickel (min.).

motorola 747

Abstract: 65516
Contextual Info: 1.172" 1 Top View 1.172" Side View 0.747" assembled 0.685" 0.175" 3 0.018" dia.typ. 0.050" typ. 2 1 2 0.605" 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ"