0.65MM PITCH BGA Search Results

0.65mm pitch BGA

Abstract: ASTM-B-488 C17200
Contextual Info: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in Electrical performance

Socket T for LGA

Contextual Info: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This new BGA Socket Adapter System from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern – offering the

0.65mm pitch BGA

Contextual Info: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This new BGA Socket Adapter System from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern – offering the

Socket T for LGA

Abstract: 0.65mm pitch BGA socket
Contextual Info: BGA Socket Adapter System Fine Pitch BGA Socket Adapter System 0.50mm and 0.65mm Pitch Table of Models Features: • Advanced’s field-proven screwmachined terminals with multifinger contacts, arranged in an interstitial male/female pin pattern are gold plated for gold/gold

0.65mm pitch BGA

Abstract: OMAP35x
Contextual Info: Application Report SPRAAV6B – June 2008 OMAP35x 0.65mm Pitch Layout Methods Keven Coates . ABSTRACT It is easy to see from the unique look that the OMAP35x parts have a very unusual

BGA 15X15

Contextual Info: Daisy Chain Package Design 15mm, 321 MAP BGA, 0.65mm Pitch 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 A B C D E F G H * 0.65 mm Pitch * 21x21 Array * 9 Thermal Balls * 15x15 mm Body Size * 0.3 mm Solder Ball Diameter J K L M N P R T U V W Y AA Slide 1

48 ball VFBGA

Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
Contextual Info: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated

LV 1084 73

Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
Contextual Info: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA

SF-PLCC84-J-01

Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
Contextual Info: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.

PA-PGA181-02W

Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
Contextual Info: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for

LPC2468 reflow solder profile

Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Contextual Info: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,

FP-X4KPG223-01

Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Contextual Info: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators

socket Yamaichi IC299

Abstract: 0.65mm pitch BGA socket yamaichi IC Test Socket IC299-08048 IC299-12859 qfn YAMAICHI SOCKET
Contextual Info: Test Contactors IC299 Series IC299- 100 30 Design No. Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: NOTE: High speed / low inductance QFP and SOP’s. Insulator: Contact: Plating: Socket Series No. of Leads Characteristics

Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

BGA 731

Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

IC 7142

Abstract: SG-BGA-7142 0.65mm pitch BGA
Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer

Contextual Info: Package Lineup Package Lineup The packages are classified as follows, according to form, material, and the mounting methods for which they are suited. Packages TÍ Vertical type, Single lead Lead inserted type SIP ZIP Horizontal type,” Double lead — Matrix type

TSOP to SOIC BGA Adapter Modules

Contextual Info: Thin Small Outline Packages TSOP to SOIC BGA Adapters ACCUTEK MICROCIRCUIT CORPORATION TSOP to SOIC BGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description The Accutek family of SOIC Adapter Modules permit the connection

Contextual Info: Thin Small Outline Packages TSOP to SOIC BGA Adapters ACCUTEK MICROCIRCUIT CORPORATION TSOP to SOIC BGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description The Accutek family of SOIC Adapter Modules permit the connection

0.65mm pitch BGA

Abstract: 0.35mm pitch BGA BGA Solder Ball 0.35mm .65mm bga land pattern BGA 0.35mm pitch bga socket bpw 50 0.35mm BGA 202 ball bga
Contextual Info: Ball / Land Grid Array Sockets EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Screw Lock Type E-tec is now the leading BGA socket manufacturer. Sockets range from 5 x 5 upwards and some of the existing patterns are shown on the following

Cortex-M4F

Contextual Info: FUJITSU SEMICONDUCTOR FACT SHEET NP709-00003-0v01-E 32-bit Microcontrollers FM4 Family MB9B360R Series MB9B360R series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with high-performance and competitive cost. MB9B360R series are based on the ARM Cortex-M4F Processor with Flash memory and SRAM, and has

au38

Abstract: ae38 diode ae38 Aj36 G37 IC AJ-38 satellite a75 AH36 n38 transistor MB2198-10
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71060-1E DSU-FR EMULATOR LQFP-64P HEADER TYPE 2 MB2198-304 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P*1 header type 2 MB2198-304 for the DSU-FR emulator. This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198300)*2 to connect the DSU-FR emulator (MB2198-01)*3 and DSU-FR cable (MB2198-10)*4 to a

Contextual Info: FUJITSU SEMICONDUCTOR FACT SHEET NP709-00002-0v01-E 32-bit Microcontrollers FM4 Family MB9B460R Series MB9B460R series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with high-performance and competitive cost. MB9B460R series are based on the ARM Cortex-M4F Processor with Flash memory and SRAM, and has

Contextual Info: IC274 Series IC274-1S1 202 • l i I I . .r .-. — C haracteristics ^ — Socket Series No. of Leads [— Insulation Resistance: Withstanding Voltage: 1,000MQminimum at 500 VDC 500 VAC for 1 Minute Contact Resistance: Operating Temperature: 30mQ max. at 10mA/20mV (Initial)