012Q Search Results

S5 100 B112 MT RELAY

Abstract: CK 66 UL 94V-0 LCD sh 0357 94v-0 c225t F8212 panduit standoff RF based remote control robot circuit diagram of incubator D1148 burndy Y35 crimping tool manual
Contextual Info: ELECTRICAL SOLUTIONS A. System Overview Click on the logo above to go to www.panduit.com up to date product information find a local distributor technical information Section Index B1. Cable Ties A. System Overview B2. Cable Accessories B. Bundle B3. Stainless

AXP 188 ba

Abstract: 21071-DA 2mb1100 AXP 188 IC 5188b RSAD 5111 1M 21071-BA 82378IB 21071AA d327c
Contextual Info: m DECchip 21071-AA, 21072-AA Core Logic Data Sheet m A p ril 1994 21071-AA, 21072-A A Features: • Supports the entire fam ily of the DECchip 21064 Alpha AXP m icroprocessors • DECchip 21071-AA: 128-bit cache/64-bit memory • DECchip 21072-AA: 128-bit cache/128-bit

Contextual Info: SIEMENS BAR 81W Silicon RF Switching Diode Preliminary data • Design for use in shunt configuration • High shunt signal isolation • Low shunt insertion loss EHA0702D Type Marking Ordering Code Pin Configuration BAR 81W BBs 1 = A1 2 = C2 3 = A2 4 = C1 SOT-343

Contextual Info: SIEMENS PNP Silicon AF Transistors BCP 51 . BCP 53 • For AF driver and output stages • High collector current • Low collector-emitter saturation voltage • Complementary types: BCP 54 . BCP 56 NPN Type BCP BCP BCP BCP BCP BCP BCP BCP BCP 51 51-10

TSXCUSB485

Abstract: allen bradley IEC 60947-5-1 xbtz9780 xbtz9980 modicon tsx NANO XBTGT TSX NANO CABLE xbt n200 xbtz925 Communication cables pin diagram XVMB1RAGS
Contextual Info: Operator dialog 1 Harmony Optimise the creation of your dialogue solutions! 2 Unequalled and of high quality, it is the largest offer on the market. 3 p Simplicity: the clip together components ensure simple and secure assembly. p Ingenuity: LED technology for all

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tic 136 d

Abstract: SLN-507
Contextual Info: 3 Stanford Microdevices Product Description SLN-507 Stanford M icrodevices’ SLN-507 is a high perform ance GaAs Heterojunction Bipolar Transistor HBT MMIC housed in a low-cost surface mount MSOP8 plastic package. H eterojunc­ tion technology is utilized for ultra-linear perform ance with

STR F 9208 L

Abstract: P45M cdm-9 CD930 CD-930G-250 HTCT250-2-1 120mm2 GCE250-250 CD-930H INDEX11
Contextual Info: ELECTRICAL SOLUTIONS A. System Overview CD-920 Crimping Dies B1. Cable Ties B2. Cable Accessories • Part number permanently marked on crimping die for easy identification • Provides circumferential crimp results in terminations with premium electrical and mechanical performance

Contextual Info: 3 Stanford Microdevices Product Description SLN-507 Stanford M icrodevices’ SLN-507 is a high perform ance GaAs Heterojunction Bipolar Transistor HBT M MIC housed in a low-cost surface mount MSOP8 plastic package. H eterojunc­ tion technology is utilized for ultra-linear perform ance with

Contextual Info: S E M IC O N D U C T O R w w w .fairchildsem i.com tm RC5034 High A c c u r a c y Synchr onous DC-DC Conver t er Features Pentium VREF; 2% accuracy >85% Efficiency 350uA quiescent current in shutdown Fast transient response Soft control power-up Over-Voltage Protection

Contextual Info: S E M IC O N D U C T O R w w w .fairchildsem i.com tm RC5034 High A c c u r a c y Synchr onous DC-DC Conver t er Features Pentium VREF; 2% accuracy >85% Efficiency 350uA quiescent current in shutdown Fast transient response Soft control power-up Over-Voltage Protection

Contextual Info: S IE M E N S NPN Silicon A F Transistor BCP 68 • For general A F application • High collector current • High current gain • Low collector-emitter saturation voltage • Complementary type: B C P 69 PNP Type BCP BCP BCP BCP 68 68-10 68-16 68-25 Marking

2SK1388

Abstract: irlz44n 10SA220M EC10QS02 EC10QS02L MBRB1545CT MTD20N03HDL RC5034 LRC251 motherboard coil
Contextual Info: F A IR C H IL D s e m ic o n d u c t o r Tm w w w .fa ir c h ild s e m i.c o m RC5034 Hi gh A c c u r a c y S y n c h r o n o u s DC-DC C o n v e r t e r Features • 3.3V power supply for Pentium based CPUs requiring 2% VRE specification motherboards Description

Analog Devices model 233J

Abstract: alfa uv API 45 AD0042C AC1007 analog devices TSDC1610 AD504 fetal monitor device circuit diagrams AD533J Helitrim AD 233J
Contextual Info: ANALOG DEVICES PRODUCT GUIDE Copyright 1975 by Analog Devices, Inc. FOREWORD This book is a guide to the broadest range of electronic compo­ nents and devices needed by designers of instrumentation and control systems which accept, analyze, process, convert, trans­

Panduit CT730

Abstract: cd7402 HTAP1000-1000-5 STR 20013 CTAPF6-12-C
Contextual Info: R uuduit Tool Chart for CTAP, CTAPF and HTAP Tool Chart for Compression-Copper CTAP’s, CTAPF’s and Aluminum HTAP’s For Installation on Copper and Aluminum Cables Using RlNDUIT Tools Tool Chart for Com pression Connectors Type - CTAP RUN TAP CT-2001

Contextual Info: ELECTRICAL SOLUTIONS A. System Overview Code Conductor, Thin Wall, CTAP B1. Cable Ties For Copper Code Stranded Connections Type CTAPF • For copper-to-copper tapping, splicing or pigtailing • Wide wire range-taking capability minimizes inventory requirements

3SB23 04-2A siemens

Abstract: 3SB24 3SB12 01 3ta21 siemens IEC 60947 VDE 0660 3SB14 00-0C siemens 3SB36 Sirius 3SB3 3SB14 3sb29
Contextual Info: Commanding and Signaling Devices Introduction • Overview 3SB2 3SB30, 3SB32 3SB31, 3SB33 3SB35, 3SB36 16 mm Plastic, round 22 mm Plastic, round 22 mm Plastic, square 22 mm Metal, round ✔ ✔ -✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ -✔ ✔ ✔ ✔ ✔ ✔ ✔

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Product Preview Low-Voltage CMOS 16-Bit Transparent Latch MC74LCX16373 LCX With 5V-Tolerant Inputs and Outputs 3-S tate, Non-Inverting The MC74LCX16373 is a high performance, non-inverting 16-bit transparent latch operating from a 2.7 to 3.6V supply. The device is byle

Contextual Info: RWDUIT Tool C hart for C o p p er LCAS a nd SC SS Splices Tool Chart for CompressiorvType Copper Lugs and Splices For Installation on Copper Cables Using RuiDIIIT Tools Tool Chart for Compression Connectors Types LCAS and SCSS with Copper Cable Die Index Number or Color Crimps per Wire

CT5002

Contextual Info: Power Connectors CUSTOM COPPER LUGS • Custom Copper Lugs from 8 AWG to 250 MCM • Options include: three barrel lengths or custom barrel lengths; inspection holes, if required; special tongues; and stud holes in various sizes, #10 to 1/2" • Custom capabilities include stacking lugs, bent lugs, heavy wall tubing, special plating or barrel markings

Contextual Info: Final Electrical Specifications r r w m TECHNOLOGY LTC1487 Ultra-Low Power RS485 with Low EMI, Shutdown and High Input Impedance January 1995 fca tu rcs DCSCftlPTIOn • High Imput Impedance: Up to 256 Transceivers on the Bus ■ Low Power: Ice * 120pA Max with Driver Disabled

2SK138

Abstract: 10SA330M
Contextual Info: F A IR C H IL D w w w .fa irc h ild s e m i.c o m s e m i c o n d u c t o r tm RC5034 Hi gh A c c u r a c y S y n c h r o n o u s DC-DC C o n v e r t e r Features Pentium VREF; 2% accuracy >85% Efficiency 350uA quiescent current in shutdown Fast transient response

7C185-15

Abstract: 7C185-20 7C185-25 7C185-35 CY7C185 CY7C185A CY7C185-15VC
Contextual Info: fax id: 1013 CY7C185 W > C Y PR ESS_ 8K x 8 Static RAM Features provided by an active LOW chip en ab le CE-| , an active H IGH chip enable (C E 2), and active LO W o u tp u t enable (OE) and three -state drivers. T his device has an au tom atic pow er-dow n

CY7C1007

Abstract: CY7C107
Contextual Info: fax id: 1058 w / CY7C107 CY7C1007 C Y P R E S S 1M x 1 Static RAM Features memory expansion is provided by an active LOW chip enable CE and three-state drivers. These devices have an automatic power-down feature that reduces power consumption by more than 65% when deselected.