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Contextual Info: Current Revision As of 1/16/2008 1:15:13 PM 134466 Rev. H Page 1 of 5 Current Revision As of 1/16/2008 1:16:01 PM 134466 Rev. H Page 2 of 5 Current Revision As of 1/16/2008 1:16:11 PM 134466 Rev. H Page 3 of 5 Current Revision As of 1/16/2008 1:16:20 PM 134466 Rev. H

312AL

Contextual Info: QWL insert arrangements 10S-2 1 16 insert arrangement number of contacts size of contacts insert arrangement number of contacts size of contacts © 12S-4 12-5 14S-4 1 1 12 1 14-3 1 16 8 16 16-12 1 18-7 1 4 8 insert arrangement number o f contacts size of contacts

Ali M1531 B1

Abstract: PCI/PNP 686 mopslcd6 M1543C A PIC based GPIB to USB adapter ali m1543c M1531 mops 686 phoenixbios d 686 Kontron mops
Contextual Info: MOPSlcd6 Technical Manual Rev. 4.0 Kontron Embedded Modules GmbH Brunnwiesenstraße 16 94469 Deggendorf/ Germany p588m140.doc Kontron Embedded Modules GmbH Page: 1 of 44 MOPSlcd6 Table of Contents 1. TABLE OF CONTENTS 1. TABLE OF CONTENTS . 2

a51dc

Abstract: 161S-AA02NPK AA-04N 140-MN-1600 161S-AA03NPK TEMPERATURE CONTROLLER with pid AVR 140-MN 161S-AA01NPK 140-MN-1000 161S-AA07NPK
Contextual Info: Bulletin 161 Single Phase AC Drive 1~ / 200-240V 0.2 – 2.2 kW Bulletin 161 Table of contents 1. Checking the scope of supply. 1 2. Structure of the device. 2

PIC16C84 MICROCHIP

Abstract: PICSTART PICSTART 16b1 MPS16B TM 1628 driver display picstart-16b1 16b1 pic16c84 1994 PIC16C5X PIC16C61
Contextual Info: Table of Contents PICSTART-16B1 USER'S GUIDE Table of Contents Preface: Welcome . 1 Feature List and Product Information . 1 Chapter 1. Introduction . 3

Nippon capacitors

Contextual Info: HB56G236 Series, HB56G136 Series HB56G236B/SB 8 MB FP DRAM SIMM 2-Mword X 36-bit, 1 k Refresh, 2-Bank Module 4 pcs of 1 M X 16 and 4 pcs of 1 M x 2 Components HB56G136B/SB 4 MB FP DRAM SIMM 1-Mword x 36-bit, 1 k Refresh, 1-Bank Module (2 pcs of 1 M x 16 and 2 pcs of 1 M x 2 Components)

Hitachi DSA00164

Abstract: Nippon capacitors
Contextual Info: HB56G236 Series, HB56G136 Series HB56G236B/SB 8 MB FP DRAM SIMM 2-Mword x 36-bit, 1 k Refresh, 2-Bank Module 4 pcs of 1 M × 16 and 4 pcs of 1 M × 2 Components HB56G136B/SB 4 MB FP DRAM SIMM 1-Mword × 36-bit, 1 k Refresh, 1-Bank Module (2 pcs of 1 M × 16 and 2 pcs of 1 M × 2 Components)

Nippon capacitors

Contextual Info: HB56G236 Series, HB56G136 Series HB56G236B/SB 8 MB FP DRAM SIMM 2-Mword X 36-bit, 1 k Refresh, 2-Bank Module 4 pcs of 1 M X 16 and 4 pcs of 1 M x 2 Components HB56G136B/SB 4 MB FP DRAM SIMM 1-Mword x 36-bit, 1 k Refresh, 1-Bank Module (2 pcs of 1 M x 16 and 2 pcs of 1 M x 2 Components)

Nippon capacitors

Contextual Info: HB56G236 Series, HB56G136 Series HB56G236B/SB 8 MB FP DRAM SIMM 2-Mword x 36-bit, 1 k Refresh, 2-Bank Module 4 pcs of 1 M × 16 and 4 pcs of 1 M × 2 Components HB56G136B/SB 4 MB FP DRAM SIMM 1-Mword × 36-bit, 1 k Refresh, 1-Bank Module (2 pcs of 1 M × 16 and 2 pcs of 1 M × 2 Components)

RLTMRL_III_655_1000-1500MW

Contextual Info: 16.08.2010 rltmrl_iii_655_1000-1500mw.doc 1 of 1

RLTMDL_845_1-30MW

Contextual Info: 16.08.2010 rltmdl_845_1-30mw.doc 1 of 1

RLTMDL_1450_1-500MW

Contextual Info: RLTMDL-1450 1-500mW 16.08.2010 rltmdl_1450_1-500mw.doc 1 of 1

Contextual Info: Current Revision As of 7/16/2013 12:25:26 PM DDYER 120120 Rev. F Page 1 of 1

Contextual Info: APPLICATION NOTE M32C/83 Group [CAN] Reception of a Data Frame REJ05B0253-0100Z Rev.1.00 Oct. 16, 2003 1. Abstract This document describes about reception of a data frame for M32C/83 group. The following is contents of this document. Table of contents 1. Abstract . 1

Contextual Info: MITSUBISHI MICROCOMPUTERS 740 Family Reference Programs 3.7 16-Bit Data Subtract Binary (1) Description Subtraction of 16-bit binary data is performed. (2) Explanation The contents of WORK01 +1 and WORK01 are subtracted from the contents of WORK00 +1 and

Mul16

Contextual Info: MITSUBISHI MICROCOMPUTERS 740 Family Reference Programs 3.10 16-Bit Data Multiply Binary (1) Description Multiplication of 16-bit binary data is performed. (2) Explanation The contents of WORK02 +1 and WORK02 are multiplied by the contents of WORK01 +1 and

Div-16

Contextual Info: MITSUBISHI MICROCOMPUTERS 740 Family Reference Programs 3.11 16-Bit Data Divide Binary (1) Description Division of 16-bit binary data is performed. (2) Explanation The contents of WORK00 +1 and WORK00 are divided by the contents of WORK02 +1 and WORK02.

ST1305B

Abstract: memory card circuit diagram
Contextual Info: ST1305B Memory Card IC 192 bit High Endurance EEPROM With Secure Logic Access Control DATA BRIEFING 1 Memory Divided Into: 1 • 1 Single Supply Voltage 5 V 1 ■ – 16 bits of Circuit Identification – 48 bits of Card Identification – 48 bits of Count Data

Contextual Info: Mounting pad of fine-pitch BGA The drawings of fine-pitch BGA mounting pads are shown in Figure 1-16, followed by Table 1-10, which provides detailed information of these pads. Figure 1-16. Mounting Pad Dimensions of Fine-pitch BGA 116 pins 12 x 12 0.8 x 12 = 9.6

micromodule

Abstract: ST1305B 24x8 memory card circuit diagram
Contextual Info: ST1305B Memory Card IC 192 bit High Endurance EEPROM With Secure Logic Access Control DATA BRIEFING 1 Memory Divided Into: 1 • 1 Single Supply Voltage 5 V 1 ■ – 16 bits of Circuit Identification – 48 bits of Card Identification – 48 bits of Count Data

RLTMRL_III_635R_1-150MW

Contextual Info: RLTMRL-III-635 round spot / 1-150mW 16.08.2010 rltmrl_iii_635r_1-150mw.doc 1 of 1

CALCULATION SemiSel 3.1

Abstract: semikron skiip3 DIN 5463 usage of skiip CALCULATION SemiSel skiip gb 120 semikron skiip vf group semikron skiip 81 AN 15 T B DIN 5463 semikron IGBT, 1200V, 600A, H bridge
Contextual Info: Usage of SKiiP Systems 10. Dezember 2002 Seite: 1 von: 16 Usage of SKiiP Systems SEMIKRON integrated intelligent Power 1 2 3 4 Main features of SKiiP2 and SKiiP3 Systems . 2

lcd 16x2 instruction set

Abstract: 16 pin diagram of lcd display 16x2 24 pin diagram of lcd display 16x2 E912112012 16X2 LCD CHARACTER CODE OSD1602M03 PDC1602M 10 pin diagram of lcd display 16x2 osd1602 16x2 lcd 4-bit
Contextual Info: OSD1602M PLED 16x2 Characters Module OSD1602M03 Specifications Date: 2004/3/1 Revision: 3.31 Document NO:E912112012 Revision: E0 Page 1 of 15 PLED 16x2 Characters Module OSD1602M03 Specifications 1. Features ‹ ‹ ‹ ‹ ‹ 2 lines of 16 characters of 5x8 dots

FillFactory

Abstract: STAR1000 FPGA cmos IMAGE SENSOR evaluation board STAR1000 cmos aps FillFactory cmos sensor
Contextual Info: Star1000 1 Mega pixel rad-hard CMOS APS STAR 1000 1 mega pixel rad-hard CMOS image sensor 7/16/2003 Page 1 of 20 Star1000 1 Mega pixel rad-hard CMOS APS Table of contents 1. SENSOR DESCRIPTION . 3