MICROMODULE Search Results

saw 36,125 mhz 16 mhz

Abstract: D469 MT5100 microtune
Contextual Info: M I C R O T U RF SILICON AND SUBSYTEMS SOLUTIONS FOR BROADBAND COMMUNICATIONS AND AUTOMOTIVE ELECTRONICS N E VIDEOCASTER MT5100 SINGLE-CHANNEL UPCONVERTER MICROMODULE PRODUCT BRIEF channel upconverter designed to reduce space, power and costs for Satellite Master Antenna Television

200B

Abstract: 24LC01B 24LC02B DK-2750 RG41
Contextual Info: M 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8

ATA5577M2

Abstract: ATA5577M1 11785 rfid ATA5577M ATA5567 ATA5577 ATA2270-EK1 ATAK2270 T5557 11785 fdx-b
Contextual Info: RF IDENTIFICATION RFID  Multifunctional 363-Bit Read/Write RFID IDIC ATA5577 Atmel offers a broad range of RFID devices for contactless read/write RF identification systems, delivered as die on wafer, die in tray, die on tape, micromodule, or complete transponder in a plastic package. Our

ST23ZL48

Abstract: TV TRANSMITTER PROJECT stmicroelectronics eeprom ST23
Contextual Info: ST23ZL48 Smartcard MCU with enhanced security, crypto-processor and 48 Kbyte EEPROM Data brief Features Hardware features • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes of linear addressable memory 259a.ai Micromodule Wafer ■ 300 Kbytes of User ROM ■

mcu st23

Abstract: ST23ZL34 TV TRANSMITTER PROJECT ST23
Contextual Info: ST23ZL34 Smartcard MCU with enhanced security, crypto-processor and 34 Kbyte EEPROM Data brief Features Hardware features • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes of linear addressable memory 259a.ai Micromodule Wafer ■ 300 Kbytes of User ROM ■

24LC08B

Abstract: 200B 24LC16B
Contextual Info: M 24LC08B/16B MODULES 8K/16K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V

Contextual Info: MicroModule USB Integration Guide Interlink Electronics FSR Force Sensing Resistors® USB MicroModule Integration Guide Document P/N: 94-00025 Rev. B Interlink Electronics and the six dot logo are registered trademarks of Interlink Electronics, Inc. www.interlinkelectronics.com

SMARTCARD micromodule assembly

Contextual Info: D5, D7 MICROMODULES Smartcard MCU Dual Modules General Information on D5 and D7 Packaging DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.

SMARTCARD micromodule assembly

Abstract: emv 7816 smartcard
Contextual Info: D3, D4 MICROMODULES Smartcard MCU Modules General Information on D3 and D4 Packaging DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.

SMARTCARD micromodule assembly

Abstract: sgs thomson ST14C04C
Contextual Info: MICROMODULES SMART CARD IC’s EMBEDDING PROCESS BRIEF DATA INTRODUCTION The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.

ST33F1M

Abstract: ST33F1M NESCRYPT ST33F1M package ST33F768 MIFARE DESFire software Desfire ev1 implementation NFC Protocol ARM SecurCore SC300 iso 7816-2 ST33F896
Contextual Info: ST33F1M, ST33F1M0, ST33F896, ST33F768, ST33F640, ST33F512 Secure MCU with 32-bit ARM SC300 CPU, SWP interface, NESCRYPT cryptoprocessor and high-density Flash memory Data brief Micromodule Wafer 259a.ai DFN8 package WLCSP package CSP Software features • Secure Flash Loader

24LC02B Modules

Contextual Info: 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules CROCHIP FEATURES ISO MODULE LAYOUT • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 1 0 ^ standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8

mm 105k capacitor

Abstract: 12V, 350mA LED driver SCHEMATIC led driver 200mA 4.5V TO 100V INPUT REGULATOR
Contextual Info: TPS92550 450mA 14W Constant Current Buck LED Driver MicroModule General Description Package Highlights The TPS92550 Constant Current Buck LED Driver MicroModule drives maximum 450mA LED current up to 10 LEDs in a single string maximum 14W . It integrates all the power

4614b

Abstract: transponder car key immobilizer transponder ic ISO 11784/85 Animal ID atmel t5557 RFID RF Identification Devices RF Identification Devices RFID immobilizer for alarm RF ICs RFID immobilizer car
Contextual Info: 125-kH Z RF I D E N T I F I C AT I O N Read/ Write Transponder Device Family Identification IC For 125-kHz contactless readwrite RF identification systems, Atmel offers a broad range of RFID devices, delivered as dieon-wafer, die-in-tray, die-ontape, micromodule or complete

GRM32ER72A225KA35L

Abstract: 105k capacitor 4.5V TO 100V INPUT REGULATOR
Contextual Info: TPS92551 450mA 23W Constant Current Buck LED Driver Micro-Module General Description ● -40˚C to +125˚C junction temperature range The TPS92551 Constant Current Buck LED Driver MicroModule drives maximum 450mA LED current up to 16 LEDs in a single string maximum 23W . It integrates all the power

Contextual Info: TPS92551 450mA 23W Constant Current Buck LED Driver MicroModule General Description Package Highlights The TPS92551 Constant Current Buck LED Driver MicroModule drives maximum 450mA LED current up to 16 LEDs in a single string maximum 23W . It integrates all the power

st23yr80

Abstract: iso 3309 ST23YR mcu st23 AIS-31 ST23 DSASW0037395
Contextual Info: ST23YR80 Dual contactless smartcard MCU with 80 Kbyte EEPROM, enhanced security, cryptoprocessor and optimized RF performance Data brief Features Hardware features • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes linear addressable memory 259a.ai Micromodule

atmel 1215

Abstract: Atmel 540 e5551 e5551 atmel t5551 T5551-PAE 2594 micromodule T555101-PAE E5551 preliminary
Contextual Info: T5551 Micromodule Description The micromodule T5551 is the standard package for Atmel Wireless & Microcontrollers’ contactless identification IC family. This package simplifies the soldering or welding handling and enables smart card applications. The micromodule is 400 µm thin, thus opening the way

24LC02B Modules

Abstract: 24lc01b 200B 24LC02B 24LC01B Modules I2C EEPROM 1kbit
Contextual Info: M 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8

24LC32A

Abstract: 200B
Contextual Info: M 24LC32A MODULE 32K I2C Serial EEPROM in ISO Micromodule FEATURES ISO MODULE LAYOUT • ISO 7816 compliant contact locations • Single supply with operation down to 2.5V - Maximum write current 3 mA at 6.0V - Maximum read current 150 µA at 6.0V - Standby current 1 µA max at 2.5V

Contextual Info: 24LC32A MODULE M ic ro c h ip 32KI2C Serial EEPROM in ISO Micromodule FEATURES ISO MODULE LAYOUT • ISO 7816 compliant contact locations • Single supply with operation down to 2.5V - Maximum write current 3 mA at 6.0V - Maximum read current 150 iA at 6.0V

Contextual Info: 24LC08B/16B MODULES M ic r o c h ip 8K/16K I 2C Serial EEPROMs in ISO Micromodules FEATURES ISO MODULE LAYOUT • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical

ISO 14443-1

Abstract: SMARTCARD micromodule assembly MICROMODULES SMARTCARD micromodule ST16R820 ST16RF52 ST16RF58 ST19RF08
Contextual Info: D5, D7 MICROMODULES Smartcard MCU Dual Modules General Information on D5 and D7 Packages DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.

8 PIN SMD IC L02

Abstract: GLOBESPAN SEMICONDUCTOR L02 SMD FUSE SMD tm
Contextual Info: bel defining a degree of excellence CO DCN HV001T S M D P a c k a g e M e c h a n ic a l In fo rm a tio n — I [— 0.080 _L JT 1 0803 - 1439-00 9752 CO RADSL-LP DCN TM MicroModule -1 .1 3 0 - PCB FOOTPRINT TOP VIEW T LI 0.350 D im ensions are in inches