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    1076WA

    Abstract: g631m Compound 6600cs Compound g631 IA186ES-PQF100I-03 FRM-72-04-1 1076 molding IA186ES
    Text: Product Change Notice Product Change Notification Number: IA186XX-D Title: Additional Molding Compound and Epoxy for Assembly flexibility Date of Notification: 9/22/2010 Samples Available: 10/22/10 Effective Date: 10/22/2010 This Change Affects Innovasic Part # IA186ES-PQF100I-03 only


    Original
    PDF IA186XX-D IA186ES-PQF100I-03 6600CS G631M 1076WA IA186ES FRM-72-04-1 1076WA g631m Compound 6600cs Compound g631 1076 molding IA186ES

    IA186EB

    Abstract: copper bond wire G631M 1076WA copper bonding wire FRM-72-04-1
    Text: Product Change Notice Product Change Notification Number: IA18XEB-D Title: Product Enhancement for the IA186 PQFP version of 16-Bit Microcontroller Date of Notification: 5/20/2013 Samples Available: immediately Effective Date: TBD This Change Affects Innovasic Part Numbers


    Original
    PDF IA18XEB-D IA186 16-Bit IA186EB-PQF80I-R-00 IA186EB-PQF80I-R-00 Compound83-5263 x-122 FRM-72-04-1 IA186EB copper bond wire G631M 1076WA copper bonding wire