11131 Search Results

Contextual Info: VBGA323T100 LSI Assembly • VBGA323T100 10.0±0.1 10.0 ±0.1 1PIN MARK 0.23 0.08 S A 0.5 B V U T R P N M L K J H G F E D C B A 323-φ0.3±0.05 φ 0.05 M S AB 1 3 5 7 9 11131517 2 4 6 8 1012141618 The contents described herein are subject to change without notice.

Contextual Info: SbE D • BüBObOS 0001035 3e]! H V C T V TB 1 1 1 2I , 11131 VTB Process Photodiodes E G & 6 VACTEC PACKAGE DIMENSIONS inch mm CASE 19 PRODUCT DESCRIPTION Small area planar silicon photodiode in a lensed, dual lead, TO-46 package. Chip is isolated from the case. These

SRA 2040

Abstract: sra 20100 SRA2020
Contextual Info: £ TAIWAN SRA2020 - SRA20100 SEMICONDUCTOR 20.0 AMPS. Schottky Barrier Rectifiers ¡0 RoHS IQ=22flAC C O M P L IA N C E l8 5 H .7 tt 1TSI4 4 4 1 n -A Mat. JU tU -ü 14^3 là', •ssìllsù. QÌW 14 1 1.V7 a?) 111317»?) 7 'Cj * ) Features -O' -0- Low pow er loss, high efficiency.

Contextual Info: To Top / Lineup / Index FUJITSU SEMICONDUCTOR DATA SHEET DS05-11131-1E MEMORY Unbuffered 4 M x 64 BIT SYNCHRONOUS DYNAMIC RAM DIMM MB8504S064EG-100/-84/-67 168-pin, 4 Clock, 2-bank, based on 2 M × 8 Bit SDRAMs with SPD • DESCRIPTION The Fujitsu MB8504S064EG is a fully decoded, CMOS Synchronous Dynamic Random Access Memory

HMD11131

Abstract: HMD-11131-2
Contextual Info: HARRIS MIiT~SE illCONDUCTOR =17 T - V t -0 7 ~QS D e M 3 0 2 E M QDOQOSM 4 f f GaAs Digital 1C MASTER/SLAVE D FLIP-FLOP HMD-11131-2 V DC - 2,5 GHz DATA RATE PRELIMINARY PRODUCT DATA NOVEMBER 1986 HARRIS MICROWAVE SEMICONDUCTOR iüdik! x FEATURES □ □

ECR-07-00

Contextual Info: 8 6 7 4 5 3 1 2 REVISION S 2 D 1.200 DIA. 2-FIN HS: 0.340 HT. LTR DESCRIPTION INIT APP'D A ERN: 111313 E.T 3/9/06 B.P 3/10/06 B ECR-07-008196 E.T 4/13/07 V.K 4/13/07 D NOTE: 1. MATERIAL: 1 3 HEAT SINK: ALUM. (BLACK ANODIZE) CLIP: BLACK PEI (UL94-VO) 3-LEG CLIP SIZE: 27mm

Contextual Info: 8 7 6 4 5 3 2 1 REVISION S 2 D LTR DESCRIPTION A ERN: 111318 INIT APP'D E.T 3/16/06 C.W 3/16/06 2.000 DIA. 4-FIN HS: 0.571 HT. D NOTE: 1. MATERIAL: 1 3 HEAT SINK: ALUM. (BLACK ANODIZE) CLIP: BLACK PEI (UL94-VO) 2-LEGS CLIP SIZE: 21mm 2. BEFORE THE HEATSINK APPLICATION, THE USER

VTB1112I

Abstract: VTB1113I
Contextual Info: SbE J> m B O B O b C ì 0 0 0 1 D 3 5 3 e]! « V C T VTB Process Photodiodes V T B 1 1 1 2 I , 11131 E G & G VACTEC PACKAGE DIMENSIONS inch mm CASE 19 TO-46 LENSED HERMETIC CHIP ACTIVE AREA: .0025 in2 (1.60 mm2) PRODUCT DESCRIPTION Sm all area planar silicon photodiode in

Contextual Info: RF2917 11 433/868/915MHZ FM/FSK RECEIVER Typical Applications • Wireless Meter Reading • Remote Data Transfers • Keyless Entry Systems • Wireless Security Systems • 433/868/915MHz ISM Band Systems Product Description -A7.00 + 0.20 sq. 0.15 0.05 0.50

HV7708PG

Abstract: HV77 HV577
Contextual Info: HV77 yj Supertax inc. h v s ? HV79 32 MHz, 64-Channel Serial To Parallel Converter With Push-Pull Outputs Ordering Information Package Options Device 80 Lead Quad Ceramic Gullwing 80 Lead Quad Plastic Gullwing Die 80 Lead Quad Ceramic Gullwing MIL-STD-883 Processed*)

Contextual Info: HV51 H V52 inc. 32-Channel Serial To Parallel Converter With Open Drain Outputs Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Lead Quad Plastic Gullwing Die 44 J-Lead Quad Ceramic Chip Carrier

Contextual Info: T6* W ty p e 50FY8 9EX MECHANICAL DATA B u lb . T -6 H E9-1, S m a ll B u tto n 9 -P in B ase.

Contextual Info: IB M 1 1 T 1 6 4 0 L P 1M x 64 144 PIN SO DIMM Features • 144 Pin JEDEC Standard, 8 Byte Small Outline Dual In-line Memory Module with 8 Byte busses • Optimized for byte-write non-parity applications • Performance: -60 ! -70 ! i^RAC ! R A S Access Tim e

gn 84134020

Abstract: 84134020 84134001 390Vrms
Contextual Info: GN Series • Current ratings from 10 to 125 amps • Output voltage 24-280 and 48-660 VAC • Direct bond copper substrate • LED input status indicator • Available with IP20 “touch-safe” cover • Transient protection built-in • UL508 Endurance Rating 10-50A

2.4GHz Cordless Phone circuit diagram

Abstract: circuit diagram of bluetooth fm transmitter bluetooth transmitter receiver circuit diagram ANTENNA 2.4ghz schematic diagram of bluetooth receiver bluetooth transmitter receiver CON20 RF2172 RF2968 lna 30MHz to
Contextual Info: RF2968 Preliminary 11 BLUETOOTHTM TRANSCEIVER Typical Applications • Bluetooth GSM/GPRS/EDGE Cellular • Cordless Phones Phones • Battery-Powered Portable Devices • Bluetooth Wireless LAN Product Description The RF2968 is a monolithic integrated circuit intended for

RS-232 IBIS models

Abstract: 11131
Contextual Info: DS14196 EIA/TIA-232 5 Driver x 3 Receiver General Description Features The DS14196 is a five driver, three receiver device which conforms to the EIA/TIA-232-E and the ITU-T V.28 standards. The flow-through pinout facilitates simple non-crossover board layout. The DS14196 provides a peripheral side

Contextual Info: Bundling and Securing C a b l e Ti e s EL-TY Extended Length Ties HellermannTyton’s El-Ty is a high strength strapping system used for supporting, securing, fastening, and spacing cables, as well as a variety of other applications requiring extra-long,

Contextual Info: RF2917 Preliminary
   

      • Wireless Meter Reading • Remote Data Transfers • Keyless Entry Systems • Wireless Security Systems • 433/868/915MHz ISM Band Systems
    The RF2917 is a monolithic integrated circuit intended for

Relais ITT

Abstract: SDS Relais Rapa Relais feme relais Relais gruner 9059 Zettler relais az 421 Relais gruner 9066 ZG450024 haller relais sds relais rs-24 v
Contextual Info: Produktübersicht Relaiskoppler / Relaissockel Relaiskoppler mit 1 Schließer oder 1 Öffner Relaiskoppler mit 2,8 mm Flachsteckanschluß Seite 6-5/4 Relaiskoppler 1 Öffner / 1 Schließer Seite 6-5/5 Relaiskoppler mit 2 x 1 Wechsler oder 3 x 1 Schließer

8086 microprocessor books

Abstract: 212 EH lgs prime 3c 1010B 230985 INTEL386 pipeline architecture Intel Microprocessor 240440 RM1689 242690 Pentium Pro 240331
Contextual Info: Pentium Pro Family Developer’s Manual Volume 2: Programmer’s Reference Manual NOTE: The Pentium Pro Family Developer’s Manual consists of three books: Pentium Pro Family Developer’s Manual, Volume 1: Specifications Order Number 242690 ; Pentium Pro Family Developer’s Manual,

diode in58

Abstract: OMRON POWER RELAY MP2 DMT 98 ATEX G 001 honeywell dcs manual Yokogawa Transducer ABB inverter motor fault code pdt 908
Contextual Info: Interface Technology and Switching Devices 2013 / 2014 7 PCB connection technology and electronics housing • PCB terminal blocks and plug-in connectors • Electronics housing Connection technology for field devices • Plug-in connectors • Cables and connectors

h3ba omron timer

Abstract: omron h3ba timer H3BA timer wiring diagram TRIAC TAG 9105 omron MA415a
Contextual Info: Cat. No. Z901-E1-05 SYSMAC NE1S Series NE1S-CPU01 Programmable Controller OPERATION MANUAL NE1S Series NE1S-CPU01 Programmable Controller Operation Manual Revised December 2006 iv Notice: OMRON products are manufactured for use according to proper procedures by a qualified operator

IS66WVD2M16DALL

Abstract: CellularRAM 66WVD2M16DALL
Contextual Info: IS66WVD2M16DALL 32Mb Async and Burst CellularRAM 2.0 Overview The IS66WVD2M16DALL is an integrated memory device containing 32Mbit Pseudo Static Random Access Memory using a self-refresh DRAM array organized as 2M words by 16 bits. The device uses a multiplexed address and data bus scheme to minimize pins and includes a industry standard burst

IS66WVC2M16DALL

Abstract: CellularRAM 66WVC2M16DALL
Contextual Info: IS66WVC2M16DALL 32Mb Async/Page/Burst CellularRAM 1.5 Overview The IS66WVC2M16DALL is an integrated memory device containing 32Mbit Pseudo Static Random Access Memory using a self-refresh DRAM array organized as 2M words by 16 bits. The device includes several