120C1 Search Results

tilex

Abstract: i7-600 Mobile GFX 2BA
Contextual Info: Intel Core i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series Datasheet — Volume Two This is volume 2 of 2. Refer to Document Number 322812 for Volume 1 November 2010 Document Number: 322813-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

jis z 0237

Abstract: transformer less power supply 12 volt 3A cs615j
Contextual Info: CS6158A A Cirrus Logic Company T1/E1 Line Interface Features • Provides Analog Transmission Line Interface for T1 and E1 Applications • Provides Line Driver, and Clock and Data Recovery Functions • Internal Generation of Transmitted Pulse Width and Pulse Shape

max1480cpi

Abstract: MAX1480Epi 1480A MAX1480BCPI 190259
Contextual Info: 19-0259; Rev O; 5/94 Com plete, Iso lated RS-485/RS-422 D ata In te rfa c e _ Features Isolated Data Interface, Typically to 1600V rms 1 minute Slew-Rate Limited for Errorless Data Transmission (MAX1480B) High-Speed, Isolated, 2.5Mbps RS-485 Interface

g41 motherboard repair

Abstract: TOM - 2088 - BH AF 82801 IBM TOM 2088 BH gm45 intel intel chipset g33 motherboard repair 2088 rgb matrix 320123 laptop lcd cable 30 pin diagram intel g31 motherboard repair
Contextual Info: Mobile Intel 4 Series Express Chipset Family Datasheet August 2008 Document Number: 320122-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PM965

Contextual Info: Mobile Intel 965 Express Chipset Family Datasheet Revision 001 May 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

Intel 82801 GBM/GHM

Abstract: Wireless WiFi Link 4965AGN pll gl960 4965AGN PM965 g41 motherboard repair pm965 motherboard philips lbb 3300 U3 AT46 gl960
Contextual Info: Mobile Intel 965 Express Chipset Family Datasheet Revision 003 June 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

g41 motherboard repair

Abstract: vrm pentium 4 MSI chipset g31 motherboard repair intel management engine lvds to eDP connector intel g41 motherboard repair
Contextual Info: Mobile Intel 4 Series Express Chipset Family Datasheet June 2009 Document Number: 320122-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

7400

Abstract: FCBGA 407 MTS controller circuit diagram gm45
Contextual Info: Mobile Intel 4 Series Express Chipset Family Datasheet January 2009 Document Number: 320122-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

diode K1V 452

Abstract: 09CCH 09E0H 09A1H 0943H 09C8 0951H 05C1H 1488h K1V 40 N
Contextual Info: SPECTRA-2488 Telecom Standard Product Data Sheet Released PM5315 SPECTRA-2488 SONET/SDH PAYLOAD EXTRACTOR/ALIGNER FOR 2488 MBIT/S Data Sheet Proprietary and Confidential Released Issue 4: November, 2001 Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use

diode K1V 645

Abstract: 0923H 0A68H 1031f 09-D2 1182h 1488h ya11 PM5332-BI 1221H
Contextual Info: 28 AM SPECTRA 1x2488 ASSP Telecom Standard Product Data Sheet Released be r, 20 03 02 :5 7: PM5332 da y, 14 Oc to SPECTRA™ 1x2488 Data Sheet Released Issue No. 3: March 2003 lo ad ed by Am r Ma ns ou ro fS ilic on Ex pe rt Te cn ol og yI nc on Tu es SONET/SDH Payload Extractor/Aligner

atmel 0328

Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
Contextual Info: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

AM26LS31A

Abstract: 75ALS191 LS 176 AM26C31D am26ls31 AM26C312
Contextual Info: Specifications and Transmission Line Practicalities Introduction This section focuses on two of industries most widely used balanced transmission line standards, the EIA RS-422 and the EIA RS-485. After reviewing key aspects of these standards, the reader will be introduced to the practicalities of implementing a differential

1221h

Abstract: diode K1V 452 1488h AG18 1AB3 K1V 40 N PM5315 SPECTRA-2488 PMC 1601 001B PM5315
Contextual Info: PMC-Sierra, Inc. PRELIMINARY PM5315 SPECTRA-2488 DATASHEET PMC-1990821 ISSUE 3 SONET/SDH PAYLOAD EXTRACTOR/ALIGNER FOR 2488 MBIT/S PM5315 SPECTRA-2488 SONET/SDH PAYLOAD EXTRACTOR/ALIGNER FOR 2488 MBIT/S DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY ISSUE 2: FEBRUARY 2001

7N60B equivalent

Abstract: 18N50 equivalent ixgh 1499 MOSFET smd 4407 IXDD 614 C 547 B W57 BJT transistor r1275ns20l R1271ns12C IXYS CS 20-22 MOF1 IXTP 220N04T2
Contextual Info: Contents Page General Contents QA and Environmental Management Systems Alphanumeric Index Symbols and Terms Nomenclature Patents and Intellectual Property I II III XVIII XX XXII CLARE Optically Isolated Solid State Relays Optically Isolated AC-Power Switches

PIC1655A

Abstract: PIC1655ai PIC1664 pic basic examples PIC1654 PIC1655XT PFD1000 PIC1650A PIC1656 PIC1670
Contextual Info: INSTRUM ENT PIC SERIES MICROCOMPUTER OPTIONS EXTENDED TEMPERATURE RANGE PIC series microcomputers are available in two temperature ranges. The preceding data sheets describe the commercial grade device, 0°C to 70°C centigrade. An industrial/automotive temperature range

UC250

Abstract: transistor c350 r2dj
Contextual Info: y IN T E G R A T E D C IR C U IT S UC150 UC250 UC350 U N IT R O D E 3A, Three Terminal Adjustable Positive Voltage Regulators FEATURES • Output voltage adjustable from 1.2V to 33V • Guaranteed 3A output current • Line regulation typically 0.005%/V • Load regulation typically 0.1%

chrysler ic

Contextual Info: 2 ha««» CDP68HC68S1 December 1994 Serial Multiplexed B u s Interface Features Description • Differential Bus for Minimal EMI The CDP68HC6SS1 Serial Bus Interface Chip SBIC) provides a means of interfacing in a Small Area Network configuration, various microcomputers (MCU’s) containing serial ports. Such

Contextual Info: 2: 34 PM SPECTRA 1x2488 ASSP Telecom Standard Product Data Sheet Released ob er ,2 00 4 02 :1 PM5332 sd ay ,2 8O ct SPECTRA™ 1x2488 Data Sheet Released Issue No. 3: March 2003 Do wn lo ad ed by C on te n tT ea m of Pa rtm in er In co n Th ur SONET/SDH Payload Extractor/Aligner

Contextual Info: 3: 35 PM SPECTRA 1x2488 ASSP Telecom Standard Product Data Sheet Released ch ,2 00 6 10 :3 PM5332 Mo nd ay ,1 3M ar SPECTRA™ 1x2488 Data Sheet Released Issue No. 4: January 2006 Do wn l oa de d by C on te nt T ea m of Pa rtm in er In co n SONET/SDH Payload Extractor/Aligner

footprint jedec MS-026 TQFP

Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

Digital Oscilloscope Preamplifier

Abstract: 86187 RPT86FP RPT86FQ RPT87FP RPT87FQ
Contextual Info: ANALO G D EVICES Low Power PCM Repeaters RPT-86/RPT-87 w ith T I 1.544Mbit/s , CEPT/E1 (2.048Mbit/s), and T1C (3.152Mbit/s) systems. FEATURES • • • • • Low Power Consum ption (56mW) Single-Supply Operation W ide Data Rate Range <100kbit/s to >3M bit/s

ILD1020

Abstract: PM573 PM5332-BI PM5332-BGI 1A90H 1S141 intel PM-400 AE-27 PM572
Contextual Info: 5: 04 PM SPECTRA 1x2488 ASSP Telecom Standard Product Data Sheet Released 7A pr il, 20 06 09 :5 PM5332 Th ur sd ay ,2 SPECTRA™ 1x2488 Data Sheet Released Issue No. 4: January 2006 Do wn lo ad ed by Co nt e nt Te a m of Pa rtm in er In co n SONET/SDH Payload Extractor/Aligner

0555B

Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Contextual Info: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7

Contextual Info: LM27A LM27A ?3C Accurate, 120C-150C Factory Preset Thermostat LM27 in Die Form Literature Number: SNOSAQ6C LM27A ±3°C Accurate, 120°C-150°C Factory Preset Thermostat (LM27 in Die Form) General Description This datasheet applies to the LM27A, which is the die form of