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Catalog Datasheet	MFG & Type	PDF	Document Tags
2N6925 Abstract: TO3 package 2n6924 Text: O General Semiconductor Industries, Inc. * NPN TRANSISTOR CHIP " Typical Device Types: 2N6924, 2N6925 37 " 35 AMP Bonding Pad Areas Fast Switching Base 1 135x28 mils Emitter (1)49 x 30 mils Typical Switching Front Metallization: Aluminum Back Metallization:	OCR Scan	PDF	2N6924, 2N6925 135x28 20nsec 90nsec 1300nsec 150nsec 50mAckage) 2N6925 TO3 package 2n6924

Catalog Datasheet

MFG & Type

PDF

Document Tags

2N6925

Abstract: TO3 package 2n6924
Text: O General Semiconductor Industries, Inc. * NPN TRANSISTOR CHIP " Typical Device Types: 2N6924, 2N6925 37 " 35 AMP Bonding Pad Areas Fast Switching Base 1 135x28 mils Emitter (1)49 x 30 mils Typical Switching Front Metallization: Aluminum Back Metallization:

OCR Scan

PDF

2N6924, 2N6925 135x28 20nsec 90nsec 1300nsec 150nsec 50mAckage) 2N6925 TO3 package 2n6924