13X2 Search Results

RC22

Abstract: 354972
Contextual Info: Datum Anforderungsstufe ERNI RC 2 2,7 5,2 XXXX class 4 ±0,2 11,45max. 1 date 0,3 2,54 0,65 13x2,54=33,02 2x2,54=5,08 38,35 48,35 5,7 0,5 c1 +0,1 37,4 -0,2 43,35 ±0,1 +0,2 +0,1 3 2,8 0,3 c14 8,5 -0,1 a1 10,6 -0,3 a14 Anschluß 0,65 x 0,3 mm / terminal 0,65 x 0,3mm

Contextual Info: White Electronic Designs W78M32V-XBX ADVANCED* 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

10001000XXX

Abstract: PWA with 555 W78M32V-XBX SA139-SA142 SA175-SA178 SA187-SA190 SA163-SA166
Contextual Info: White Electronic Designs W78M32V-XBX 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

Contextual Info: A141JL101M063A aka PEG124MD3100ML1 Axial Cylindrical Aluminum Electrolytic, 100 uF, 20% Tol, 13x29 Case LL – L LL+ F D Dimensions mm Specifications ID Dimension Tolerance D L LL+ LLF 13 29 42 42 0.8 +/-0.5 +/-1 Powered by IntelliData.net +3/-2 +/-0.03

Contextual Info: c1 a1 13x2,54=33,02 2,54 S = standard 3 -0,4 L = late mate, early break / nacheilend 6,4 -0,1 2,5 +0,1 E = early mate, late break / voreilend 6 ±0,1 0,6 2x2,54=5,08 37,5 4,8 ±0,2 0,8 ±0,1 a14 ESL 11,1max. 2,5 8,7 Stecklänge / mating length 0,8 ±0,1 0,5

Contextual Info: White Electronic Designs W78M64V-XSBX PRELIMINARY 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

bsc 60h

Contextual Info: White Electronic Designs W72M64V-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package *Advanced FEATURES • Access Times of 100, 120, 150ns ■ Unlock Bypass Program command ■ Packaging • • 159 PBGA, 13x22mm - 1.27mm pitch Reduces overall programming time when issuing

Contextual Info: AXAIL PACKAGE & WEIGHT AXAIL TYPE, BULK PACKAGE SEQ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 36 DIMENSION 6.3mm 8mm 10x17mm 10x21mm 10x26mm 13x21mm 13x26mm 16x28mm 16x33mm 16x37mm 18x37mm 22x37mm 22x42mm 25x42mm ONE BAG 500 pcs 500 pcs 200 pcs 200 pcs 200 pcs 200 pcs

JS-CH-2008R-XX

Contextual Info: 1 2 3 4 5 6 7 SPECIFICATIONS Voltage Rating: Current Rating: Contact Material: Contact Resistance: Base Material: Insulation Resistance: Withstanding: Temperature Range: A B C Poles 3x2 4x2 5x2 6x2 7x2 8x2 9x2 10x2 11x2 12x2 13x2 14x2 15x2 16x2 D E F 8 9 A

OB 3.5 750

Abstract: 8x12 1S50
Contextual Info: 10 1 A C ( h F) 16(1 C ) Rtf Me PgtniTOta 8X12 1.00 170 R tf size rwiara 25(1 E) mm R tf sire 47 470 1 00 101 220 221 10X13 0.60 250 10X13 3 30 331 10X16 0.40 370 10X16 470 471 10X16 0.40 370 10X20 1000 102 13X20 0.16 750 13X25 2200 2 22 16X25 0.00 1250

JS-2008R-XX

Abstract: 14x2
Contextual Info: 1 2 3 4 5 6 7 SPECIFICATIONS Voltage Rating: Current Rating: Contact Material: Contact Resistance: Base Material: Insulation Resistance: Withstanding: Temperature Range: A B C Poles 3x2 4x2 5x2 6x2 7x2 8x2 9x2 10x2 11x2 12x2 13x2 14x2 15x2 16x2 D E F 8 9 A

millionspot

Abstract: millionspot H820 relay tv3 H820 12v, DPST relay DPST 24V RELAY h820 relay 5V DPST RELAY relay 6V 9V DPDT 250AC/30VDC
Contextual Info: - MILLIONSPOT - FEATURES H820 s e r ie s 4^ • 5 AMPS, TV-3 RATED • HEAVY DUTY MINIATURE SLIM TYPE POWER RELAY •S IZ E : 29.5 x 13x21 mm • HIGH ISOLATION IN SMALL PACKAGE - INSULATION DISTANCE : 8mm

W78M32V-XBX

Contextual Info: White Electronic Designs W78M32V-XBX 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

1513b

Abstract: OCXO
Contextual Info: OVEN CONTROLLED CRYSTAL OSCILLATORS O-C84-0XSXXXXX-X Ultra Low Phase Noise, Precision SC-cut HF OCXO in Tiny 13x20x11 mm DIP14 Package Data Sheet 1513B Rev. - Product Data Sheet Features •    SC-cut crystal Ultra Low Phase Noise Sine Wave +15 dBm output

Contextual Info: White Electronic Designs W78M32V-XBX PRELIMINARY* 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

Contextual Info: White Electronic Designs W78M32V-XBX 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

Contextual Info: White Electronic Designs W78M64V-XSBX PRELIMINARY 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

W78M64V-XSBX

Abstract: SA159-SA162 SA222
Contextual Info: White Electronic Designs W78M64V-XSBX 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

Contextual Info: OCXO Evaluation Board for 13x20, 25x25, 25x37, 50x50 mm Models OCXO Eval Board The Vectron OCXO Evaluation Board is designed to allow the user to test a variety of industry standard platform sizes and pinouts utilizing the same fixture. It will accept four different sized packages: 13x20 mm 4-pin DIP , 25x25 mm (1x1in), 25x37 mm (Eurocase), and 50x50 mm (2x2

DIN ISO 286

Abstract: 374166
Contextual Info: +0,2 2,54 11,1 max. 0,8 ±0,1 ESL E = early mate, late break / voreilend 6 ±0,1 3,95 0,6 13x2,54=33,02 S = standard 3 -0,4 +0,1 2,54 L = late mate, early break / nacheilend Datum / date code Stecklänge/ 3 +0,1 2x2,54=5,08 2,54 RC 2 14,5 ±0,1 ERNI 6,4 -0,1

Contextual Info: White Electronic Designs W78M64V-XSBX ADVANCED 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

17X33

Abstract: 17X48
Contextual Info: Within ±10% of the initial measured value < 150% K IIffl2 0 0 % < 150% ol the initial specified value i 200%of the initial specified value 330V DC 2U 010 013 014.5 016 017 e18 020 016 20 200 10X25 13X20 40 400 10X30 13X25 60 600 13X30 14.5X25 80 800 13X35

W78M64V-XSBX

Contextual Info: White Electronic Designs W78M64V-XSBX 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

z0107

Abstract: Z0307 FDS6680A SK14A Z0202 Z0207 Z0102 z0105 Z0212 Z0308
Contextual Info: 5 4 +2.5V +1.25V 3 VIN 2 1 +2.5V +1.25V +1.8V +12V +3V +5V +5V +3V +1.8V PCN1 1 3 5 7 9 11 13 15 17 19 21 23 25 D 3 3 3 +2.5V_SEN +1.25V_ON VCC2.5_ON PCN2 2 4 6 8 10 12 14 16 18 20 22 24 26 +1.25V_SEN GND_SEN 1 3 5 7 9 11 13 15 17 19 21 23 25 3 3 HEADER 13X2