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    TM2015

    Abstract: TM-2003 2a09 TM2016 TM 2016 CARSEM G600 MIC2177YWM MIC5219YMM MIL-STD-883 PRESSURE
    Text: RELIABILITY REPORT DATE: 09/17/03 QUALITY ENG : PURPOSE: Dinh Pham LEAD FREE PKG QUAL 408 474-3621 QUAL VEHICLES : PACKAGE TYPE : ASSEMBLY LOC M/C LOT # FAB D/C # PROCESS MIC2177YWM 20L WSOIC CARSEM 6600 3A02058MEA SJ 0313 BCC MIC5219YMM 8L MSOP UNISEM G600


    Original     		PDF MIC2177YWM 3A02058MEA MIC5219YMM 145779MEA 0237G MIC5248BM5 OT-23 6710S 2A09099MEA 1000HR TM2015 TM-2003 2a09 TM2016 TM 2016 CARSEM G600 MIC2177YWM MIC5219YMM MIL-STD-883 PRESSURE

    B1340

    Abstract: sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E
    Text: Q1-2004-MICREL- PKG STORAGE LIFE TEST BAKE TA = + 150C Package Family PKG Type Lds Device WM W-SOIC W-SOIC W-SOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC 16 16 16 20 28 28 28 28 28 28 28 MIC2027 MIC2527 MIC2527 MIC2177 MIC1700B SY69952ZC SY69952ZC


    Original     		PDF Q1-2004-MICREL- MIC2027 MIC2527 MIC2177 MIC1700B SY69952ZC SY87701V B1340 sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E

    MIC29151WU

    Abstract: MIC2171WU MIC29151BU MIC2177YWM 20L SOT-23 UNISEM Preconditioning 3a204
    Text: RELIABILITY REPORT DATE: 4/28/2004 QUALITY ENG : Herb Grimm PURPOSE: Matte Tin Reliability Test Summary. HTOL - High Temperature Operating Life Test TA= + 125°C PACKAGE TYPE : PART NO. LOT ID. 168 HR 500 HR 1000HR SSOP 28L MIC2563AYSM 2A28088M01 0/116 0/116


    Original     		PDF 1000HR MIC2563AYSM 2A28088M01 MIC2177YWM 3A02058MEA OT-23 MIC5248YM 2A09099MEA O-263 MIC29151WU MIC29151WU MIC2171WU MIC29151BU MIC2177YWM 20L SOT-23 UNISEM Preconditioning 3a204