14X22MM Search Results

153BGA

Contextual Info: 128K x 72 SSRAM Multi-Chip Package WEDPY128K72V-XBX Optimum Density and Performance in one Package WEDPY128K72V-XBX* • Designed as L2 Cache for the PowerPC 750 see page 2 for typical application block diagram • PACKAGE: 14x22mm, 153 Plastic Ball Grid Array (PBGA), 308mm2

Contextual Info: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* • Designed as L2 Cache for advanced processors see other side for typical application block diagram Performance Features AR Y Fast clock speeds: 200, 166, 150, 133 and 100MHz

Contextual Info: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* • Designed as L2 Cache for advanced processors see other side for typical application block diagram Fast clock speeds: 200, 166, 150, 133 and 100MHz High performance 2-1-1-1 access rate

WEDPY256K72V-XBX

Contextual Info: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* Designed as L2 Cache for advanced processors see other side for typical application block diagram Performance Features • Fast clock speeds: 200, 166, 150, 133 and 100MHz

NEC VR4300

Abstract: JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
Contextual Info: High Performance! Contents 目次 1. BGA とは？ ―――――――――――――― 3 2. NEC の BGA は？ ―――――――――――― 3 3. 特徴 ―――――――――――――――――― 4 4. パッケージ写真 ――――――――――――― 6

GS78108A

Abstract: GS78108AB GS78108AB-10 GS78108AB-10I GS78108AB-12 GS78108AB-12I GS78108AB-15I GS78108AB-8 GS78108AB-8I
Contextual Info: GS78108AB 1M x 8 8Mb Asynchronous SRAM BGA Commercial Temp Industrial Temp Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 240/190/170 mA at minimum cycle time • Single 3.3 V ± 0.3 V power supply • All inputs and outputs are TTL-compatible

GS78108AGB-10

Abstract: GS78108AGB-8 78108A GS78108A GS78108AB GS78108AB-10 GS78108AB-10I GS78108AB-12 GS78108AB-12I GS78108AB-15I
Contextual Info: GS78108AB 1M x 8 8Mb Asynchronous SRAM BGA Commercial Temp Industrial Temp Features 8, 10, 12 ns 3.3 V VDD Symbol Pin Descriptions Description A0 to A19 Address input DQ1 to DQ8 Data input/output CE Chip enable input WE Write enable input OE Output enable input

Contextual Info: 256K x 72 SSRAM Multi-Chip Package ▼ Optimum Density and Performance in One Package WEDPY256K72V-XBX* Designed as L2 Cache for advanced processors see other sidefor typical application block diagram Performance Features • • • • • • • •

GS78108A

Abstract: GS78108AB GS78108AB-10 GS78108AB-10I GS78108AB-12 GS78108AB-12I GS78108AB-15I GS78108AB-8 GS78108AB-8I
Contextual Info: Preliminary GS78108AB BGA Commercial Temp Industrial Temp 1M x 8 8Mb Asynchronous SRAM Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 240/190/170 mA at minimum cycle time • Single 3.3 V ± 0.3 V power supply • All inputs and outputs are TTL-compatible

Contextual Info: IS61LV12824 128K x 24 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY FEATURES • High-speed access time: 8, 9, 10, 12 ns • CMOS low power operation — 720 mW typical operating @ 9 ns — 36 mW (typical) standby @ 9 ns • TTL compatible interface levels

graphic card circuit diagram

Abstract: SMART ASIC bga HJ945010BP SH3-DSP hitachi sh3 network 7729R hitachi sh3 MCP market SH7729 hm52256
Contextual Info: EP-MT-01002A-02 Hitachi MCM/MCP Products Hitachi MCM/MCP Products Feb.1st, 2001 Multi Chip Module Products Design Dept. DRAM Business Division Semiconductor & Integrated Circuits Hitachi Ltd. EP-MT-01002A-02 Hitachi MCM/MCP Products 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright,

SH3-DSP

Abstract: 7729R HJ945020 sdram pcb gerber hitachi sh3 HJ945010BP HJ945010 SH7729 SH7750 hitachi sh4
Contextual Info: EP-MT-01001A-02 Hitachi MCM/MCP Products 日立 MCM/MCP プロダクツ 2001年 3月1日 株式会社 日立製作所 半導体グループ DRAM事業部 MCM設計部 製品技術Gr. Hitachi MCM/MCP Products EP-MT-01001A-02 1. 本書に記載の製品及び技術のうち「外国為替及び外国貿易法」に基づき安全保障貿易管理関連貨物・技術に該当するものを輸出する

Contextual Info: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* Designed as L2 Cache for advanced processors see other side for typical application block diagram Performance Features • Fast clock speeds: 200, 166, 150, 133 and 100MHz

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

WEDPY256K72V-XBX

Contextual Info: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* • Designed as L2 Cache for advanced processors see other side for typical application block diagram Performance Features • • • • • • • •

Contextual Info: GS78108AB 1M x 8 8Mb Asynchronous SRAM BGA Commercial Temp Industrial Temp Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 240/190/170 mA at minimum cycle time • Single 3.3 V ± 0.3 V power supply • All inputs and outputs are TTL-compatible

Contextual Info: GS78108AB BGA Commercial Temp Industrial Temp 1M x 8 8Mb Asynchronous SRAM 8, 10, 12 ns 3.3 V VDD Features Symbol Pin Descriptions Description A0 to A19 Address input DQ1 to DQ8 Data input/output CE Chip enable input WE Write enable input OE Output enable input

WEDPY256K72V-XBX

Contextual Info: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* • Designed as L2 Cache for advanced processors see other side for typical application block diagram Fast clock speeds: 200, 166, 150, 133 and 100MHz High performance 2-1-1-1 access rate