176P6D Search Results

M38881M2XXXFP

Abstract: M38881M2 M38802M2 M37510 176P6D M37690E8-XXXFP M38881M2XXXGP 80P6S-A m38813m4 m38802e2
Contextual Info: B uilt-in LCD driver type Memory type Memory size byte 20K One time PROM Mask ROM 32K One time PROM OnetimePROM Mask ROM OnelimePROM Type I*». Package ROM RAM Mask ROM Mask ROM # 24K 60K M37500M5-XXXFP 160P6E-A M37500M5-XXXGP 176P6D M37500E5-XXXFP M37500E5-XXXGP

LQFP176-P-2424

Contextual Info: 176P6D-A Plastic 176pin 24✕24mm body LQFP EIAJ Package Code LQFP176-P-2424-0.50 Weight g Lead Material Alloy 42 MD e JEDEC Code – HD ME D 133 1 b2 176 132 I2 E HE Recommended Mount Pad 44 Symbol 89 45 88 A L1 F A1 c A2 e b y L Detail F A A1 A2 b c D E

tra 7510

Contextual Info: MITSUBISHI MICROCOMPUTERS 7510 Group SINGLE-CHIP 8-BIT CMOS M ICROCOM PUTER DESCRIPTION • 2 C lo c k g e n e ra tin g c irc u it T h e 7 5 1 0 g ro u p is th e 8 -b it m ic ro c o m p u te r b a s e d on th e 7 4 0 fa m ­ C o n n e c t to e x te rn a l c e ra m ic re s o n a to r o r q u a rtz -c ry s ta l.

432W6

Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P

bq 7510

Contextual Info: MITSUBISHI MICROCOMPUTERS 7510 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER DESCRIPTION • 2 C lock ge n e ra tin g circu it The 7510 group is the 8 -b it m icro co m p u te r based on the C o n n e c t to 740 fa m ily core technology. crystal. • This m icro co m p u te r is e q u ip p e d w ith a d d e d tunctions such

SEG55

Abstract: SEG60 M37510E M37510 160D0 Mitsubishi 7510
Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Mitsubishi Electric and Mitsubishi XX, to Renesas Technology Corp. The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

Contextual Info: MITSUBISHI MICROCOMPUTERS 7510 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER DESCRIPTION • The 7510 group is the 8-bit microcomputer based on the 740 family core technology. This microcomputer is equipped with added functions such as a dot matrix type LCD controller/driver built in a contrast

100MHZ

Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,

M37500M8

Contextual Info: MITSUBISHI MICROCOMPUTERS 7500 Group SINGLE-CHIP 8-B IT CMOS MICROCOMPUTER DESCRIPTION • 2 C lo c k gen e ra tin g circuit T h e 7 5 0 0 group is th e 8 -b it m icro com puter b a s e d on the C o n n e c t to external c era m ic resonator or quartz-crystal

ic mark

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

48P4B

Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P

160D0

Abstract: SEG55 SEG60
Contextual Info: MITSUBISHI MICROCOMPUTERS 7510 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER DESCRIPTION The 7510 group is the 8-bit microcomputer based on the 740 family core technology. This microcomputer is equipped with added functions such as a dot matrix type LCD controller/driver built in a contrast controller

10C2

Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension

324pc

Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension