HSSOP Search Results

HSSOP14

Contextual Info: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 14Pin Plastic HSSOP14 225mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

HSSOP16

Contextual Info: SANYO Semiconductor Shrink Small Outline Package with Heat Sink 16Pin Plastic HSSOP16 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

hssop

Abstract: HSSOP-A54
Contextual Info: HSSOP-A54 LSI Assembly Units : mm • HSSOP-A54 22.0 28 1 27 4.0 13.4 11.4 54 6.0 H=1.0Max. The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any

42P9R-B

Abstract: PRSP0042GB-B
Contextual Info: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-B Previous Code 42P9R-B MASS[Typ.] 0.7g F 22 42 E1 E *1 1 c 21 Index mark *2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Reference

42P9R-D

Abstract: PRSP0042GB-D 42P9RD
Contextual Info: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-D Previous Code 42P9R-D MASS[Typ.] 0.7g F 22 42 E *1 HE E1 D2 1 21 Index mark c NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.

PRSP0052JB-A

Contextual Info: JEITA Package Code P-HSSOP52-8.4x17.5-0.65 RENESAS Code PRSP0052JB-A Previous Code 52P9F-J MASS[Typ.] 0.8g F 52 27 E1 E *1 1 Index mark NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c 26 L HE D2

PRSP0042GB-M

Abstract: PRSP0042GB
Contextual Info: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-M Previous Code 42P9R-M MASS[Typ.] 0.7g F 22 42 E *1 HE E1 D2 1 21 Index mark *2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.

PRSP0052JB-B

Contextual Info: JEITA Package Code P-HSSOP52-8.4x17.5-0.65 RENESAS Code PRSP0052JB-B Previous Code 52P9F-K MASS[Typ.] 0.8g F 52 27 E *1 E1 HE D2 1 Index mark Reference Symbol D L *2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.

Contextual Info: SANYO Semiconductor Shrink Small Outline Package With Heat Sink 13Pin Plastic HSSOP13 225mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the names

Contextual Info: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48R 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

PRSP0042GB-A

Contextual Info: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-A Previous Code 42P9R-A MASS[Typ.] 0.7g F 42 22 E1 E *1 1 Index mark c 21 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Reference

PRSP0042GB-E

Contextual Info: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-E Previous Code 42P9R-E MASS[Typ.] 0.7g F 42 22 E1 E *1 1 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 21 Index mark c Reference

PRSP0042GB-J

Contextual Info: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-J Previous Code 42P9R-J MASS[Typ.] 0.7g F 42 22 E1 E *1 1 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 21 Index mark c Reference

PRSP0052JA-B

Contextual Info: JEITA Package Code P-HSSOP52-8.4x17.5-0.65 RENESAS Code PRSP0052JA-B Previous Code 52P9Y-K MASS[Typ.] 0.8g F 52 27 HE E1 1 26 Index mark *1 E D2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c

PRSP0042GB-H

Abstract: 42P9R-H
Contextual Info: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-H Previous Code 42P9R-H MASS[Typ.] 0.7g F 22 42 E *1 HE E1 D2 1 21 Index mark Reference Symbol D L *2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT

PRSP0052JA-A

Contextual Info: JEITA Package Code P-HSSOP52-8.4x17.5-0.65 RENESAS Code PRSP0052JA-A Previous Code 52P9Y-J MASS[Typ.] 0.8g F 52 27 E1 E *1 1 26 Index mark *2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c Reference

PRSP0042GB-G

Abstract: PHSSOP
Contextual Info: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-G Previous Code 42P9R-G MASS[Typ.] 0.7g F 42 22 E1 E *1 1 Index mark c 21 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Reference

375MIL

Contextual Info: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48R 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

PRSP0042GB-C

Contextual Info: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-C Previous Code 42P9R-C MASS[Typ.] 0.7g F 42 22 E1 E *1 1 21 Index mark NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c Reference

PRSP0042GB-F

Contextual Info: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-F Previous Code 42P9R-F MASS[Typ.] 0.7g F 22 42 E *1 HE E1 D2 1 21 Index mark *2 c NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.

HSSOP14

Contextual Info: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 14Pin Plastic HSSOP14 225mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

hssop

Abstract: HSSOP-A54
Contextual Info: HSSOP-A54 LSI Assembly • HSSOP-A54 22.0±0.2 MAX 22.35 include BURR 0.1± 0.1 6.0± 0.2 0.8 0.36±0.1 0.3MIN 4.0± 0.2 1 2.2±0.1 4¼+6¼ -4¼ 28 13.4±0.3 11.4±0.2 54 27 0.15± 0.1 0.1 (Units : mm) The contents described herein are subject to change without notice.

Contextual Info: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the