HSSOP14
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 14Pin Plastic HSSOP14 225mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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14Pin
HSSOP14
225mil)
ED-7303A)
HSSOP14
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PDF
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HSSOP16
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package with Heat Sink 16Pin Plastic HSSOP16 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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16Pin
HSSOP16
275mil)
ED-7303A)
HSSOP16
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Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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48Pin
HSSOP48
375mil)
ED-7303A
HSSOP48
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PDF
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hssop
Abstract: HSSOP-A54
Text: HSSOP-A54 LSI Assembly Units : mm • HSSOP-A54 22.0 28 1 27 4.0 13.4 11.4 54 6.0 H=1.0Max. The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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HSSOP-A54
hssop
HSSOP-A54
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42P9R-B
Abstract: PRSP0042GB-B
Text: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-B Previous Code 42P9R-B MASS[Typ.] 0.7g F 22 42 E1 E *1 1 c 21 Index mark *2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Reference
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P-HSSOP42-8
PRSP0042GB-B
42P9R-B
42P9R-B
PRSP0042GB-B
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PDF
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42P9R-D
Abstract: PRSP0042GB-D 42P9RD
Text: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-D Previous Code 42P9R-D MASS[Typ.] 0.7g F 22 42 E *1 HE E1 D2 1 21 Index mark c NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
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P-HSSOP42-8
PRSP0042GB-D
42P9R-D
42P9R-D
PRSP0042GB-D
42P9RD
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PRSP0052JB-A
Abstract: No abstract text available
Text: JEITA Package Code P-HSSOP52-8.4x17.5-0.65 RENESAS Code PRSP0052JB-A Previous Code 52P9F-J MASS[Typ.] 0.8g F 52 27 E1 E *1 1 Index mark NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c 26 L HE D2
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P-HSSOP52-8
PRSP0052JB-A
52P9F-J
PRSP0052JB-A
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PRSP0042GB-M
Abstract: PRSP0042GB
Text: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-M Previous Code 42P9R-M MASS[Typ.] 0.7g F 22 42 E *1 HE E1 D2 1 21 Index mark *2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
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P-HSSOP42-8
PRSP0042GB-M
42P9R-M
PRSP0042GB-M
PRSP0042GB
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PDF
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PRSP0052JB-B
Abstract: No abstract text available
Text: JEITA Package Code P-HSSOP52-8.4x17.5-0.65 RENESAS Code PRSP0052JB-B Previous Code 52P9F-K MASS[Typ.] 0.8g F 52 27 E *1 E1 HE D2 1 Index mark Reference Symbol D L *2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
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P-HSSOP52-8
PRSP0052JB-B
52P9F-K
PRSP0052JB-B
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PDF
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Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package With Heat Sink 13Pin Plastic HSSOP13 225mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the names
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13Pin
HSSOP13
225mil)
ED-7303A)
HSSOP13
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Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48R 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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48Pin
HSSOP48R
375mil)
ED-7303A)
HSSOP48R
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PRSP0042GB-A
Abstract: No abstract text available
Text: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-A Previous Code 42P9R-A MASS[Typ.] 0.7g F 42 22 E1 E *1 1 Index mark c 21 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Reference
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P-HSSOP42-8
PRSP0042GB-A
42P9R-A
PRSP0042GB-A
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PDF
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PRSP0042GB-E
Abstract: No abstract text available
Text: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-E Previous Code 42P9R-E MASS[Typ.] 0.7g F 42 22 E1 E *1 1 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 21 Index mark c Reference
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P-HSSOP42-8
PRSP0042GB-E
42P9R-E
PRSP0042GB-E
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PDF
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PRSP0042GB-J
Abstract: No abstract text available
Text: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-J Previous Code 42P9R-J MASS[Typ.] 0.7g F 42 22 E1 E *1 1 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 21 Index mark c Reference
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P-HSSOP42-8
PRSP0042GB-J
42P9R-J
PRSP0042GB-J
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PDF
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PRSP0052JA-B
Abstract: No abstract text available
Text: JEITA Package Code P-HSSOP52-8.4x17.5-0.65 RENESAS Code PRSP0052JA-B Previous Code 52P9Y-K MASS[Typ.] 0.8g F 52 27 HE E1 1 26 Index mark *1 E D2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c
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P-HSSOP52-8
PRSP0052JA-B
52P9Y-K
PRSP0052JA-B
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PRSP0042GB-H
Abstract: 42P9R-H
Text: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-H Previous Code 42P9R-H MASS[Typ.] 0.7g F 22 42 E *1 HE E1 D2 1 21 Index mark Reference Symbol D L *2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT
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P-HSSOP42-8
PRSP0042GB-H
42P9R-H
PRSP0042GB-H
42P9R-H
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PRSP0052JA-A
Abstract: No abstract text available
Text: JEITA Package Code P-HSSOP52-8.4x17.5-0.65 RENESAS Code PRSP0052JA-A Previous Code 52P9Y-J MASS[Typ.] 0.8g F 52 27 E1 E *1 1 26 Index mark *2 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c Reference
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P-HSSOP52-8
PRSP0052JA-A
52P9Y-J
PRSP0052JA-A
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PDF
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PRSP0042GB-G
Abstract: PHSSOP
Text: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-G Previous Code 42P9R-G MASS[Typ.] 0.7g F 42 22 E1 E *1 1 Index mark c 21 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Reference
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P-HSSOP42-8
PRSP0042GB-G
42P9R-G
PRSP0042GB-G
PHSSOP
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375MIL
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48R 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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48Pin
HSSOP48R
375mil)
ED-7303A
HSSOP48R
375MIL
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PDF
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PRSP0042GB-C
Abstract: No abstract text available
Text: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-C Previous Code 42P9R-C MASS[Typ.] 0.7g F 42 22 E1 E *1 1 21 Index mark NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c Reference
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P-HSSOP42-8
PRSP0042GB-C
42P9R-C
PRSP0042GB-C
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PDF
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PRSP0042GB-F
Abstract: No abstract text available
Text: JEITA Package Code P-HSSOP42-8.4x17.5-0.80 RENESAS Code PRSP0042GB-F Previous Code 42P9R-F MASS[Typ.] 0.7g F 22 42 E *1 HE E1 D2 1 21 Index mark *2 c NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
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P-HSSOP42-8
PRSP0042GB-F
42P9R-F
PRSP0042GB-F
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PDF
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HSSOP14
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 14Pin Plastic HSSOP14 225mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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14Pin
HSSOP14
225mil)
ED-7303A
HSSOP14
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PDF
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hssop
Abstract: HSSOP-A54
Text: HSSOP-A54 LSI Assembly • HSSOP-A54 22.0±0.2 MAX 22.35 include BURR 0.1± 0.1 6.0± 0.2 0.8 0.36±0.1 0.3MIN 4.0± 0.2 1 2.2±0.1 4¼+6¼ -4¼ 28 13.4±0.3 11.4±0.2 54 27 0.15± 0.1 0.1 (Units : mm) The contents described herein are subject to change without notice.
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HSSOP-A54
hssop
HSSOP-A54
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PDF
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Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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Original
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48Pin
HSSOP48
375mil)
ED-7303A)
HSSOP48
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PDF
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