19X19 Search Results

P-FBGA404-19x19-0

Abstract: 19X19 PRBG0404GA-A
Contextual Info: JEITA Package Code P-FBGA404-19x19-0.80 RENESAS Code PRBG0404GA-A Previous Code ⎯ MASS[Typ.] 1.1g D w S B E w S A 4x v y1 S y A1 A S S ZD e A e AB AA Y W V U T Reference Symbol R B P N M L K J H G Dimension in Millimeters Min Nom D 19 E 19 Max v 0.15 w

19X19

Abstract: PBGA324 PRBG0324FA-A P-BGA-324 324f
Contextual Info: JEITA Package Code P-BGA324-19x19-1.00 RENESAS Code PRBG0324FA-A D B D1 Previous Code 324F7X-A MASS[Typ.] 1.1g A b A ZD S AB e ZE V U T R P N M L K J H G F E D C B E1 E e A1 A y S Index mark S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Reference Symbol D

19X19

Abstract: CMBA021919 Malico BGA 15X15 RCA 014
Contextual Info: CMBA021919Series=MBH19002 Series MBH19002-H12 MBH19002-H25 = 1373254 = 1373255 Model : CMBA021919 Series For 19x19 Chip set BGA Heat Sink CMBA021919 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 19x19mm Height : 12,15,18,21,23,28,33 mm

Contextual Info: Product: XRT86VL32IB-F Package: 225L PBGA 19x19 Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight (mg) Element/Compound CAS No. 1 Die 25.40 Silicon 7440‐21‐3 25.4000

240-PIN

Contextual Info: 240-PIN PLASTIC FBGA 19x19 OUTLINE DRAWINGS D w S B B D1 ZD SD 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 ZE A E1 E SE w INDEX MARK 4 – R0.3 S A AA W U R N L J G E C A AB Y V T P M K H F D B 4 – C1.0 A 25° A2 S y1 S e y S 240 – φ b

Contextual Info: 304 PIN FINE PITCH BGA 19x19 A W S B B B 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D AA W U R N L J G E C A AB Y V T P M K H F D B P Index mark Q W S A J I Y1 S H R S K S F L E φM M G S A B NOTES 1. Controlling dimension millimeter. 2. Each ball centerline is located within φ 0.08 mm of

PRBG0436GA-A

Contextual Info: JEITA Package Code P-HFBGA436-19x19-0.80 RENESAS Code PRBG0436GA-A Previous Code 436F7S w S B D MASS[Typ.] 1.6g w S A φb φx M S AB A D1 ZD A1 e C2.2 y S C0.7 AB AA Y W V U T R P N M L K J H G F E D C B A B ZE E1 E 2-C0.2 y1 S e A 1 2 3 4 5 6 7 8 9 10111213141516171819202122

Contextual Info: XINDALI ELECTRONICS H.K. CO., LIMITED PACKAGE DIMENSION HS-19x19 Pb Pb-free XINDALI ELECTRONICS(H.K.) CO., LIMITED http://www.szxindali.com email: oversales@szxindali.com Tel: 86-755-21356896 Fax: 86-755-83491172

19X19

Contextual Info: NO.：QB/SPS 73 PS 5071A SPECIFICATIONS NAME: 19X19 COLOR LED CLUSTER TYPE: LCS19009 Y Q2A-003 SHENZHEN DITELONG INDUSTRIAL CO.,LTD. SHENZHEN CANDELA ELECTRONIC CO.,LTD. SHENZHEN SUCCESS PHOTOELECTRONICS CO.,LTD SHENZHEN OFFICE Add: Room 1911,Zhongwin Science & Techn.Bldg,Bagua 3th Rd.Bagualing Industry Zone Shenzhen,China

5037A

Abstract: 19X19
Contextual Info: NO.：QB/SPS 73 PS 5037A SPECIFICATIONS NAME: 19X19 COLOR LED CLUSTER TYPE: LCS19116Q4A-113 SHENZHEN DITELONG INDUSTRIAL CO.,LTD. SHENZHEN CANDELA ELECTRONIC CO.,LTD. SHENZHEN SUCCESS PHOTOELECTRONICS CO.,LTD SHENZHEN OFFICE Add: Room 1911,Zhongwin Science & Techn.Bldg,Bagua 3th Rd.Bagualing Industry Zone Shenzhen,China

19X19

Contextual Info: NO.：QB/SPS 73 PS 5036A SPECIFICATIONS NAME: 19X19 COLOR LED CLUSTER TYPE: LCS19026Q3A-022 SHENZHEN DITELONG INDUSTRIAL CO.,LTD. SHENZHEN CANDELA ELECTRONIC CO.,LTD. SHENZHEN SUCCESS PHOTOELECTRONICS CO.,LTD SHENZHEN OFFICE Add: Room 1911,Zhongwin Science & Techn.Bldg,Bagua 3th Rd.Bagualing Industry Zone Shenzhen,China

19X19

Abstract: 5006A
Contextual Info: NO.：QB/SPS 73 PS 5006A SPECIFICATIONS NAME: 19X19 COLOR LED CLUSTER TYPE: LCS19121Q4A-121 SHENZHEN DITELONG INDUSTRIAL CO.,LTD. SHENZHEN CANDELA ELECTRONIC CO.,LTD. SHENZHEN SUCCESS PHOTOELECTRONICS CO.,LTD SHENZHEN OFFICE Add: Room 1911,Zhongwin Science & Techn.Bldg,Bagua 3th Rd.Bagualing Industry Zone Shenzhen,China

Contextual Info: Tooling — PGA-ET Series * Allows device removal without damaging pins or device body * Available for 10 x 10 through 19x19 grids 9 18 x 18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION A B P G A -E T -1 0 x 1 0 1.09 2 7 . 69

Contextual Info: ADBM-A350 Optical Finger Navigation Data Sheet Description Features The ADBM-A350 sensor is a small form factor SFF optical finger navigation system. • Low power architecture The ADBM-A350 is a low- power optical finger navigation sensor. It has a new, low-power architecture and

P802

Abstract: TLK3104SA TLK3104SAGNT
Contextual Info: TLK3104SA QUAD 3.125 Gbps SERIAL TRANSCEIVER SCAS651B-− AUGUST 2000 − REVISED SEPTEMBER 2001 D Quad 3.125 Gbps per Channel Transceiver D D D D D D D D Providing 10 Gbps Data Throughput Selectable Synchronized or Independent Channel Operation Selectable Transmitter Only, Receiver Only,

Contextual Info: ADVANCED -100" 2-54mm staggered (Interstitial) PGA Footprints . INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

89H48H12G3

Abstract: TSI350A
Contextual Info: Comprehensive Portfolio from the Leader in PCI Express Solutions Integrated DeviceTechnology ANALOG AND RF | INTERFACE AND CONNECTIVITY PCI Express Timing Solutions Highly Integrated Clocks for PCIe-based Systems The IDT PCI Express timing products meet or

Contextual Info: TLK4015 QUAD 0.6 to 1.5 Gbps TRANSCEIVER SLLS541B − DECEMBER 2002 − REVISED JULY 2006 D Hot Plug Protection D Quad 0.6 to 1.5 Gigabits Per Second Gbps Serializer/Deserializer D Independent Channel Operation D 2.5-V Power Supply for Low-Power D D D D

hall marking code A04

Abstract: INTELDX4 write-through YSS 928
Contextual Info: INTEL486 PROCESSOR FAMILY • lntelDX4TM P ro c e s s o r — Up to 100-MHz Operation -Speed-M ultiplying Technology — 32-Bit Architecture — 16K-Byte On-Chip Cache — Integrated Floating-Point Unit — 3.3V Core Operation with 5V Tolerant I/O Buffers

SPRS372G

Contextual Info: TMS320DM647 TMS320DM648 SPRS372G – MAY 2007 – REVISED NOVEMBER 2011 www.ti.com TMS320DM647/TMS320DM648 Digital Media Processor Check for Samples: TMS320DM647, TMS320DM648 1 Features 1 • High-Performance Digital Media Processor – 720-MHz, 800-MHz, 900-MHz, 1.1-GHz

Contextual Info: TMS320DM647 TMS320DM648 Digital Media Processor www.ti.com SPRS372D – MAY 2007 – REVISED APRIL 2009 1 TMS320DM647, TMS320DM648 Digital Media Processor 1.1 Features • • • High-Performance Digital Media Processor – 720-MHz, 800-MHz, 900-MHz C64x+ Clock

MachXO sysIO Usage Guide

Abstract: LCMXO256C-4M100C LCMXO2280 lcmxo640c-3tn100i LCMXO640C-3FT256C LCMXO1200 LCMXO256 LCMXO2280E-4M132I LVCMOS15 LVCMOS25
Contextual Info: MachXO Family Data Sheet Version 02.3_4W February 2007 MachXO Family Data Sheet Introduction April 2006 Data Sheet • Flexible I/O Buffer Features • Programmable sysIO buffer supports wide range of interfaces: − LVCMOS 3.3/2.5/1.8/1.5/1.2 − LVTTL

e500v2

Abstract: MSC8157 BSC9132
Contextual Info: TM August 2013 50B Connected Nodes by 2020* Computers People Everything 1 2 3 1T $100 1.0 2.0 3.0 100B Cloud 10B Wireless Enterprise 1B $1 10M Past 1990 Today 2000 1¢ 2010 2 1 Future 3 2020 *Source Ericsson Factory Automation TM 2 Smart Energy Transportation

samsung EMMC user guide

Abstract: Jedec lpddr2 samsung lpddr2 Mobile RAM samsung eMMC 4.5 MX53UG n78c AMBA AXI dma controller designer user guide lpddr2 layout SONY VTR M15 DIAGRAM DDR3 jedec
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 4, 11/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information