MALICO Search Results

Malico

Abstract: CMBF014242XXXX-00 DCLIP045450900-00 DCLIP045450902-00
Contextual Info: 2L 2 . CMBF A 01 A. 42 42 _6_ 14 2 . 2 REV A B C D E 01-00 a . ALTERATION N EVRELEASE DATE CHECKED 06.16.2006 Nicole A -REFERENCE NUMBER FDRGE PART NUMBER- -TOTAL HEIGHT RANG DN MALICO STANDARD PRDDNUT AS BELDV REFERENCE NUMBER <2 DIGH T ' MALICO STANDARD TYPE

STR WG 253

Abstract: L30A fci burndy y644m dieless hypress tube y644 y644 2N/STR WG 253
Contextual Info: SE211915 CONDUCTOR BOLT SIZE CATALOG NO. CODE CAWG YAZ1C-2TC14 *1 AUG Í J YAZ1C-2TC14-45 FIG. NO. B ±.06 C ±.04 1.38 T353 .67 75 1/4 [M63 n 7J H REF. E t. 02 .62 Cl 63 K DIA. ±.02 1.57 [403 .27 [73 1.90 [48J YAZ1C-2TC14-90 YAZ1C-2TC14E2 YAZ1C-2TC1 4E2-45

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

Y34A burndy hypress

Abstract: YAZ8C2TC1045 fci burndy y644m dieless hypress Y14MV y644 A69J
Contextual Info: 1 HEJtfTHS'nS" S E 2 1 1915 CONDUCTOR CATALOG NO. CODE AWG NAVY BOLT SIZE YAZV10-2TC10 FIG. NO. DIMENSIONS B ±.04 C ±.04 .69 [18] .36 [9] #10 YAZV10-2TC10-45 E ±.02 .62 [16] 14-10 YAZV10-2TC14-45 2^ 5mm2 STR 4mmi SOL 4mm2 STR H REF. .77 [20] .41 [10]

SD73608

Abstract: burndy S-1
Contextual Info: r SD79597 1 1 ¿¡CCOMMQCxl 72? AUJMtsJUH rVBSr T 7 6 C A r& ié » F*é> hJO Sv-v'A, i £>A ^ Svs/A S & A — Z^O Z Z 3 H S D I A . Sv^/A 1£) A - ^ 4/0 S B A S S A - 3 4 nJ S ^ A l A - 4 4 ^ S ^ A S S A -4-4/0 S^j A A — .'ZrJ z ' / z X z . g n s d i a ) S vnjA i S A ~ ^ 4 nJ

C6000

Abstract: JESD51-2 JESD51-3 JESD51-7 TMS320C6000 grafoil heat spreading
Contextual Info: Application Report SPRAAL9 – May 2007 Thermal Considerations for TMS320DM64xx, TMS320DM64x, and TMS320C6000 Devices Kimberly Wells .

Contextual Info: S NAP on G CLIP ASSEMBLING UIDE INSTALLATION ………. 1. Center Snap on clip alongside BGA chip set. 3. Press down on other side to fasten onto the BGA chip set. 2. Tilt Snap on clip and slip one grappler under edge of BGA chip set. 4. Wiggle part to ensure good

TB-093

Abstract: Heat Technology
Contextual Info: Technical Brief High-Speed Board Design Advisor Thermal Management Introduction This document contains a step-by-step tutorial and checklist with a best-practice set of step-by-step guidelines to support users to design and review their thermal design with Stratix II GX FPGAs.

Contextual Info: ELECTRICAL CONNECTORS bolted type CONNECTEURS ÉLECTRIQUES (serrage mécanique) MATERIALES DE CONEXIONES ELÉCTRICAS (con rosca) Aerial mains Réseaux aériens Redes aéreas INSULATION PIERCING CONNECTORS CONNECTEURS À PERFORATION D’ISOLANT CONECTORES A PERFORACIÓN DE AISLANTE

xilinx topside marking

Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

xilinx part marking

Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

YA6C-2TC14

Abstract: SE208777-01 burndy y500ct BCT500 Y451
Contextual Info: I DRAWING NO. 7 SE208777 FIG. NO. CATALOG NO. CONDUCTOR CODE AWG #6 AWG YA6C—2TC10 NA' DIMENSIONS BOLT SIZE O.D. 1.12 [28] 30 #10 [M5] YA6C—2TC10 —45 .42 [ 11] .62 [16] YA6C—2TC10 —90 1.06 [27] 1.40 [36] .21 [5] YA6C-2TC10E2 YA6C— 2TC10E2—45

datasheet of Z40-12.7B heat sink

Abstract: UB35-25B Chomerics of Z40-12.7B heat sink Z3512 EP2S15 JESD51-9 T412 laird gasket JESD51-X
Contextual Info: Thermal Management for FPGAs December 2009 AN-358-2.0 Introduction As IC process geometries shrink and FPGA densities increase, managing power becomes increasingly difficult. The dilemma for design groups is how to fit in all the functions the market demands without exceeding power budgets. Although power

DM644x

Abstract: JESD51-2 JESD51-3 JESD51-7
Contextual Info: Application Report SPRAAE4A – April 2008 TMS320DM644x Thermal Considerations . Device Applications ABSTRACT As IC components become more integrated and more complex, the challenge of

JEDS51-2

Abstract: xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680
Contextual Info: Application Note: Packaging R Packaging Thermal Management XAPP415 v1.0 December 19, 2001 Thermal Management Modern high-speed logic devices consume appreciable amount of electrical energy. This energy invariably turns into heat. Higher device integration drives technologies to produce

CU1100

Abstract: MBA42.5002 bu series MBA42 MBA-42
Contextual Info: Model : MBA42.5002 Series For 42.5x42.5 Chip set BGA Heat Sink MBA42.5002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic UL94-V0 2.Heat sink dimension : Foot print : 42.5x42.5mm Part no. Height Fin shape Base MBA42.5002MBA42.5002MBA42.5002MBA42.5002-

FC-BGA

Abstract: T0812012 daewon tray
Contextual Info: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.

Loctite 3873

Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
Contextual Info: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the

AL6063T5

Contextual Info: in _R REV ALTERATION NEWRELEASE Changed the mark on clip DATE CHECKED 12.05.2006 Nicole 36.13.2007 Kenoi B B Chip S e t T h ick n e ss / UUUUUUUUUUUUUUUUUUUUUÜUUUUUUUUUUUU -BGA CHIP SET SEE NOTES 1 16672222 NOTES: 1: A D CCUpSatlUckM) Clip-Color 2.1mm~2.fimm

Contextual Info: Model Name : MBA31001-15W/2.6 BGA Heat Sink For 31x31 Chip set MBA31001-15W/2.6 Specification: 1.Material: Heat Sink : Aluminum 6063 Clip : Plastic UL94-V0 2.Heat Sink Dimension : 30.6*30.6*14.6 mm height (with base) Base : 2.6mm, Fin height : 12mm 3.Weight: 15.3 gm

CU1100

Abstract: MBA35002
Contextual Info: Model : MBA35002 Series For 35x35 Chip set BGA Heat Sink MBA35002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic UL94-V0 2.Heat sink dimension : Foot print : 35x35mm Part no. Height Fin shape Base MBA35002MBA35002MBA35002MBA35002- 12

plastic ul94v0

Abstract: 45x45 bga 45x45 mm bga 6063
Contextual Info: Model Name : MBA45001-15W/2.6 BGA Heat Sink For 45x45 Chip set MBA45001-15W/2.6 Specification: 1.Material: Heat Sink : Aluminum 6063 Clip : Plastic UL94-V0 2.Heat Sink Dimension : 44.6*44.6*14.6 mm height (with base) Base : 2.6mm, Fin height : 12mm 3.Weight: 31.2 gm

STR 457

Abstract: WA48A-4N JH 425 A 8p56
Contextual Info: itrv . SD 64446 1.75- D E S C R IP T IO N my C ’K’O. 9-17-71 DIM. FOP.WA2 5R-4M ^DDEDf'DO 3-^2 1 2 J P 5 2 3 R E V IS IO N OATg Y - x i - i o DIM. FO R WA3ilR-4NADDED !>032B0< O P S ! |3 / 2 4 / 0 0 NEW FORMAT, CHG. MCM TG kcrnil AND UPDATE NOTES PER EGG 5 5 4 9 ,

str wg 753

Abstract: fci burndy y644m dieless hypress Burndy Y35 hypress FRAMATOME CONNECTORS BURNDY ELECTRICAL BCT500 Y34A burndy hypress Burndy Y34A Y644 C106J STR WG 253 Y7000BH
Contextual Info: REV, 061 9 95 T 5E211915 BOLT SIZE C :. 04 L-1 CODE AWG YAZ8C-2TC10 _L FIG. NO. < #8 AWG [10mm2 STR] .75 [19] #10 Y A Z 8 C - 2 T C 1 0-45 H MAX. E ±.02 ±.02 .41 .21 [10] [5] .62 [16] [M5] .91 [23] Y A Z 8 C -2TC10E2 Y A Z 8 C - 2TC10E2-90 .75 [19] #10