1GG6 Search Results
1GG6 Price and Stock
Winbond Electronics Corp W631GG6NB09I-TRIC DRAM 1GBIT SSTL 15 96VFBGA |
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W631GG6NB09I-TR | Reel | 3,000 | 3,000 |
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Winbond Electronics Corp W631GG6NB15I-TRIC DRAM 1GBIT SSTL 15 96VFBGA |
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W631GG6NB15I-TR | Cut Tape | 2,960 | 1 |
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Winbond Electronics Corp W631GG6NB11I-TRIC DRAM 1GBIT SSTL 15 96VFBGA |
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W631GG6NB11I-TR | Cut Tape | 2,500 | 1 |
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Winbond Electronics Corp W971GG6NB-25-TRIC DRAM 1GBIT SSTL 18 84TFBGA |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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W971GG6NB-25-TR | Reel | 2,500 | 2,500 |
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Winbond Electronics Corp W631GG6NB-15-TRIC DRAM 1GBIT SSTL 15 96VFBGA |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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W631GG6NB-15-TR | Digi-Reel | 1,864 |
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1GG6 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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1gg6Contextual Info: Agilent HMMC-5032 17.7–32 GHz Amplifier 1GG6-8009 Data Sheet Features • • • • • 22 dBm output P –1 dB 8 dB gain 50 Ω input/output matching Small size Bias: 4.5 volts, 250 mA Chip size: Chip size tolerance: Chip thickness: Pad dimensions: 1370 x 770 µm (53.3 x 30.0 mils) |
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HMMC-5032 1GG6-8009 HMMC-5040 HMMC-5618 5989-6209EN 1gg6 | |
1gg6
Abstract: agilent HMMC
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HMMC-5040 1GG6-4066 5989-6449EN 1gg6 agilent HMMC | |
Contextual Info: Agilent 1GG6-4080 0.155 – 43 Gb/s Differential I/O, High Power, Output Amplifier Data Sheet Features • Frequency range: 50 GHz single–ended , 30 GHz (diff.) • Single–ended or fully differential I/O operation • Low additive jitter: 600 fs, (43 Gb/s 231 – 1 PRBS, RMS typ.) |
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1GG6-4080 5991-1251EN | |
Contextual Info: Agilent 1GG6-8083 250–8000 MHz MMIC Low Distortion IQ Modulator TC932 Data Sheet Features • Broadband: 250 - 8000 MHz • High Linearity: -74 dBc ACLR 4-carrier WCDMA, 2 GHz • Low +8 dBm LO Drive Chip Size: Chip Size Tolerance: Chip Thickness: Pad Dimensions: |
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1GG6-8083 TC932 TC932 TC932P | |
1gg6
Abstract: application tca 780 MA3531 agilent HMMC
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HMMC-5033 1GG6-8008 HMMC-5040 HMMC-5618 5989-6210EN 1gg6 application tca 780 MA3531 agilent HMMC | |
1gg6
Abstract: 1GG6-8070 TC956 1GG6-4070 GaAs MMIC ESD, Die Attach and Bonding Guidelines TC906 Die Attach and Bonding Guidelines 8070 1gg64070 AGILENT 3070
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1GG6-8070 TC956 TC956 1GG6-8070 TC956/rev 1gg6 1GG6-4070 GaAs MMIC ESD, Die Attach and Bonding Guidelines TC906 Die Attach and Bonding Guidelines 8070 1gg64070 AGILENT 3070 | |
MMIC Amplifier A08Contextual Info: Agilent HMMC-5032 17.7–32 GHz Amplifier 1GG6-8009 Data Sheet Features • • • • • 22 dBm output P –1 dB 8 dB gain 50 Ω input/output matching Small size Bias: 4.5 volts, 250 mA Chip size: Chip size tolerance: Chip thickness: Pad dimensions: 1370 x 770 µm (53.3 x 30.0 mils) |
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HMMC-5032 1GG6-8009 HMMC-5032 HMMC-5040 20-40m 5989-6209EN MMIC Amplifier A08 | |
guide gaas mmic distributed amplifier
Abstract: 1gg6 2686 0112 agilent HMMC Traveling Wave Amplifier
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HMMC-5025 1GG6-8000 5989-6207EN guide gaas mmic distributed amplifier 1gg6 2686 0112 agilent HMMC Traveling Wave Amplifier | |
1gg6Contextual Info: Agilent HMMC–5023 23 GHz LNA 21.2–26.5 GHz 1GG6-8001 Data Sheet Features • Frequency range: 21.2-23.6 GHz and 24.5-26.5 GHz specified 21-30 GHz performance • Low-noise temperature: 226 k (2.5 dB N.F.) typical • High gain: 24 dB typical • 50 Ω input/output matching |
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1GG6-8001 HMMC-5023 5989-6206EN 1gg6 | |
Contextual Info: Agilent 1GG6-8054 DC–75 GHz SPDT GaAs MMIC Switch TC950 Data Sheet Features 630 x 930 µm 24.8 x 36.6 mils ± 10 µm (± 0.4 mils) 50 ± 15 µm (2.0 ± 0.6 mils) 80 x 80 µm (3.2 x 3.2 mils) Chip Size: Chip Size Tolerance: Chip Thickness: Pad Dimensions: |
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1GG6-8054 TC950 TC950 TC950/rev3 | |
TCA 789
Abstract: 1gg6
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1GG6-8001 HMMC-5023 5989-6206EN TCA 789 1gg6 | |
TC950
Abstract: 1gg6 8054 1GG6-8054 GaAs MMIC ESD, Die Attach and Bonding Guidelines 0747 ics
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1GG6-8054 TC950 TC950 DC-75 TC950/rev3 1gg6 8054 1GG6-8054 GaAs MMIC ESD, Die Attach and Bonding Guidelines 0747 ics | |
45580
Abstract: 1gg6-8002 TCA 430 1gg6 TCA 975 HMMC-5020 hmmc-5 tca 761
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HMMC-5618 1GG6-8002 5989-6212EN 45580 TCA 430 1gg6 TCA 975 HMMC-5020 hmmc-5 tca 761 | |
45580
Abstract: 1gg6-8002 4433 fet tca 761 1gg6 8002 amplifier HMMC-5618 GaAs MMIC ESD, Die Attach and Bonding Guidelines agilent HMMC
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HMMC-5617 1GG6-8002 HMMC-5617 5989-9479EN 45580 1gg6-8002 4433 fet tca 761 1gg6 8002 amplifier HMMC-5618 GaAs MMIC ESD, Die Attach and Bonding Guidelines agilent HMMC | |
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Contextual Info: M ITSUBISHI M IC RO CO M PUTERS 3806 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER DESCRIPTION • Clock generating c ir c u it. Internal feedback resistor T he 3806 group is 8 -b it m icro co m p ute r based on the 740 fa m ily connect to external ceram ic resonator or quartz-crystal |
OCR Scan |
I-9609 3806GROUP |